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參數(shù)資料
| 型號： | TPS75101QPWPREPR |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | 基準(zhǔn)電壓源/電流源 |
| 英文描述： | FAST-TRANSIENT-RESPONSE 1.5-A LOW-DROPOUT VOLTAGE REGULATORS |
| 中文描述： | 快速瞬態(tài)響應(yīng)1.5低壓差電壓調(diào)節(jié)器 |
| 文件頁數(shù)： | 25/27頁 |
| 文件大?。?/td> | 398K |
| 代理商： | TPS75101QPWPREPR |
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TPS75101-Q1,
’
75115-Q1,
’
75118-Q1,
’
75125-Q1,
’
75133-Q1 WITH POWER GOOD
TPS75301-Q1, TPS75315-Q1, TPS75318-Q1, TPS75325-Q1, TPS75333-Q1 WITH RESET
FAST-TRANSIENT-RESPONSE 1.5-A LOW-DROPOUT VOLTAGE REGULATORS
SGLS159
–
APRIL 2003
25
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
THERMAL INFORMATION
thermally enhanced TSSOP-20 (PWP
–
PowerPad
) (continued)
If the system implements a TPS75133QPWP regulator, where V
I
= 5 V and I
O
= 800 mA, the internal power
dissipation is:
PD(total)
VI
VO
IO
(5
3.3)
0.8
1.36 W
(9)
Comparing P
D(total)
with P
D(max)
reveals that the power dissipation in this example does not exceed the calculated
limit. When it does, one of two corrective actions should be made: raising the power-dissipation limit by increasing
the airflow or the heat-sink area, or lowering the internal power dissipation of the regulator by reducing the input
voltage or the load current. In either case, the above calculations should be repeated with the new system
parameters.
mounting information
The primary requirement is to complete the thermal contact between the thermal pad and the PWB metal. The
thermal pad is a solderable surface and is fully intended to be soldered at the time the component is mounted.
Although voiding in the thermal-pad solder-connection is not desirable, up to 50% voiding is acceptable. The data
included in Figures 26 and 27 is for soldered connections with voiding between 20% and 50%. The thermal analysis
shows no significant difference resulting from the variation in voiding percentage.
Figure 29 shows the solder-mask land pattern for the
PWP package. The minimum recommended heat-
sink area is also illustrated. This is simply a copper
plane under the body extent of the package, including
metal routed under terminals 1, 10, 11, and 20.
Figure 29. PWP Package Land Pattern
Location of Exposed
Thermal Pad on
PWP Package
Minimum Recommended
Heat-Sink Area
相關(guān)PDF資料 |
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| TPS75133QPWPRQ1 | CB 2C 2#0 PIN RECP WALL |
| TPS75125QPWPRQ1 | FAST-TRANSIENT-RESPONSE 1.5-A LOW-DROPOUT VOLTAGE REGULATORS |
| TPS75633KTTR | FAST-TRANSIENT RESPONSE 5-A LOW-DROPOUT VOLTAGE REGULATORS |
| TPS75615KTTR | FAST-TRANSIENT RESPONSE 5-A LOW-DROPOUT VOLTAGE REGULATORS |
| TPS75625KTTR | FAST-TRANSIENT RESPONSE 5-A LOW-DROPOUT VOLTAGE REGULATORS |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TPS75101QPWPRG4 | 功能描述:低壓差穩(wěn)壓器 - LDO Fast-Tran-Resp 1.5-A RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負(fù)載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| TPS75103YFFR | 功能描述:LED照明驅(qū)動器 Low Dropout Two- Bank LED Driver RoHS:否 制造商:STMicroelectronics 輸入電壓:11.5 V to 23 V 工作頻率: 最大電源電流:1.7 mA 輸出電流: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SO-16N |
| TPS75103YFFT | 功能描述:LED照明驅(qū)動器 Low Dropout 2 Bank LED Driver RoHS:否 制造商:STMicroelectronics 輸入電壓:11.5 V to 23 V 工作頻率: 最大電源電流:1.7 mA 輸出電流: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SO-16N |
| TPS75105DSKEVM-529 | 功能描述:電源管理IC開發(fā)工具 TPS75105DSKEVM-529 RoHS:否 制造商:Maxim Integrated 產(chǎn)品:Evaluation Kits 類型:Battery Management 工具用于評估:MAX17710GB 輸入電壓: 輸出電壓:1.8 V |
| TPS75105DSKR | 功能描述:LED照明驅(qū)動器 LDO,Two-Bank LED Driver RoHS:否 制造商:STMicroelectronics 輸入電壓:11.5 V to 23 V 工作頻率: 最大電源電流:1.7 mA 輸出電流: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SO-16N |
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