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參數(shù)資料
| 型號： | TPS74812DRCR |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | 1.5A LDO Linear Regulator with Programmable Soft-Start |
| 中文描述： | 1.5A的LDO線性穩(wěn)壓器，具有可編程軟啟動 |
| 文件頁數(shù)： | 13/19頁 |
| 文件大小： | 351K |
| 代理商： | TPS74812DRCR |
www.ti.com
INTERNAL CURRENT LIMIT
The TPS74801 features a factory-trimmed, accurate
current limit that is flat over temperature and supply
voltage. The current limit allows the device to supply
surges of up to 2A and maintain regulation. The
current limit responds in about 10
μ
s to reduce the
current during a short-circuit fault.
LAYOUT RECOMMENDATIONS AND POWER
DISSIPATION
An optimal layout can greatly improve transient
performance, PSRR, and noise. To minimize the
voltage drop on the input of the device during load
transients, the capacitance on IN and BIAS should
be connected as close as possible to the device.
This capacitance also minimizes the effects of
parasitic inductance and resistance of the input
source and can, therefore, improve stability. To
achieve optimal transient performance and accuracy,
the top side of R
1
in
Figure 25
should be connected
as close as possible to the load. If BIAS is connected
to IN, it is recommended to connect BIAS as close to
the sense point of the input supply as possible. This
connection minimizes the voltage drop on BIAS
during transient conditions and can improve the
turn-on response.
THERMAL PROTECTION
Thermal protection disables the output when the
junction temperature rises to approximately +160
°
C,
allowing the device to cool. When the junction
temperature cools to approximately +140
°
C, the
output circuitry is enabled. Depending on power
dissipation,
thermal
resistance,
temperature the thermal protection circuit may cycle
on and off. This cycling limits the dissipation of the
regulator, protecting it from damage as a result of
overheating.
P = (V
V
)
I
-
′
IN
OUT
OUT
(4)
R
=
q
JA
(+125 C
T )
°
P
D
-
(5)
TPS74801
SBVS074–JANUARY 2007
The internal current limit protection circuitry of the
TPS74801 is designed to protect against overload
conditions. It is not intended to allow operation above
the rated current of the device. Continuously running
the TPS74801 above the rated current degrades
device reliability.
Knowing the device power dissipation and proper
sizing of the thermal plane that is connected to the
thermal pad is critical to avoiding thermal shutdown
and ensuring reliable operation. Power dissipation of
the device depends on input voltage and load
conditions and can be calculated using
Equation 4
:
and
ambient
Power dissipation can be minimized and greater
efficiency can be achieved by using the lowest
possible input voltage necessary to achieve the
required output voltage regulation.
Activation of the thermal protection circuit indicates
excessive
power
dissipation
heatsinking.
For
reliable
temperature should be limited to +125
°
C maximum.
To estimate the margin of safety in a complete
design (including heatsink), increase the ambient
temperature until thermal protection is triggered; use
worst-case loads and signal conditions. For good
reliability, thermal protection should trigger at least
+40
°
C
above
the
maximum
condition of the application. This condition produces
a worst-case junction temperature of +125
°
C at the
highest
expected
ambient
worst-case load.
or
inadequate
junction
operation,
On the SON (DRC) package, the primary conduction
path for heat is through the exposed pad to the
printed
circuit
board
(PCB).
connected to ground or be left floating; however, it
should be attached to an appropriate amount of
copper PCB area to ensure the device will not
overheat. The maximum junction to ambient thermal
resistance
depends
on
temperature, maximum device junction temperature,
and power dissipation of the device, and can be
calculated using
Equation 5
:
The
pad
can
be
expected
ambient
the
maximum
ambient
temperature
and
The internal protection circuitry of the TPS74801 is
designed to protect against overload conditions. It is
not
intended
to
replace
Continuously running the TPS74801 into thermal
shutdown degrades device reliability.
proper
heatsinking.
Knowing the maximum R
θ
JA
and system air flow, the
minimum amount of PCB copper area needed for
appropriate heatsinking can be calculated using
Figure 29
through
Figure 31
.
13
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