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參數(shù)資料
| 型號(hào)： | TPS65708YZHT |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | SWITCHING CONTROLLER, PBGA16 |
| 封裝： | GREEN, DSBGA-16 |
| 文件頁數(shù)： | 12/22頁 |
| 文件大?。?/td> | 2189K |
| 代理商： | TPS65708YZHT |
SLVSAE1A
– OCTOBER 2010 – REVISED FEBRUARY 2011
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
SIZE FOR WCSP
PACKAGE
TA
PART NO.(1)
OPTIONS
PACKAGE
VERSION
CODE
MARKING
VDCDC1 = 3.3V
VDCDC2 = 1.8V
VLDO1 = 2.8V
D = 2076
m ±25 m
–40°C to 85°C
TPS65708
VLDO2 = 1.2V
YZH
WCSP
TPS65708
E = 2076
m ±25 m
ISINK(PWM=1) = 7.5mA
SEQUENCING : DCDC1,
LDO1, DCDC2, LDO2
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder on ti.com, (http://www.ti.com)
ABSOLUTE MAXIMUM RATINGS
Over operating free-air temperature range (unless otherwise noted).
(1)
VALUE
UNIT
MIN
MAX
all pins except A/PGND pins with respect to
–0.3
7
V
AGND
Voltage range
pin VLDO1 and VLDO2 with respect to AGND
–0.3
3.6
V
L1, L2, VLDO1, VLDO2, PGND
700mA
mA
Current
AGND, ISINK
50mA
mA
all other pins
3mA
mA
Operating free-air temperature, TA
–40
85
°C
Maximum junction temperature, TJ
125
°C
Storage temperature, TST
–65
150
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
TPS65708
THERMAL METRIC(1)
UNITS
YZH (16 Pins)
θJA
Junction-to-ambient thermal resistance
75
θJCtop
Junction-to-case (top) thermal resistance
22
θJB
Junction-to-board thermal resistance
26
°C/W
ψJT
Junction-to-top characterization parameter
0.2
ψJB
Junction-to-board characterization parameter
24
θJCbot
Junction-to-case (bottom) thermal resistance
N/A
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
2010–2011, Texas Instruments Incorporated
Product Folder Link(s) :TPS65708
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