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參數(shù)資料
| 型號(hào)： | TPS613 |
| 英文描述： | PHOTOTRANSISTOR | NPN | DOME-3.0 |
| 中文描述： | 光電晶體管|叩|穹頂- 3.0 |
| 文件頁數(shù)： | 20/22頁 |
| 文件大?。?/td> | 392K |
| 代理商： | TPS613 |
TPS61000, TPS61001, TPS61002, TPS61003, TPS61004, TPS61005, TPS61006, TPS61007
SINGLE-AND DUAL-CELL BOOST CONVERTER WITH START-UP INTO FULL LOAD
SLVS279B – MARCH 2000 – REVISED AUGUST 2000
20
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
THERMAL INFORMATION
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-
dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below:
Improving the power dissipation capability of the PWB design
Improving the thermal coupling of the component to the PWB
Introducing airflow in the system
The maximum junction temperature (T
J
) of the TPS6100x devices is 125
°
C. The thermal resistance of the
10-pin MSOP package (DGS) is R
θ
JA
= 294
°
C/W. Specified regulator operation is assured to a maximum
ambient temperature (T
A
) of 85
°
C. Therefore, the maximum power dissipation is about 130 mW. More power
can be dissipated if the maximum ambient temperature of the application is lower.
mW
W
C
C
C
JA
R
A
MAX
J
T
MAX
D
P
136
/
294
85
125
)
(
)
(
=
°
°
–
°
=
Θ
=
(8)
–
Under normal operating conditions, the sum of all losses generated inside the converter IC is less than 50 mW,
which is well below the maximum allowed power dissipation of 136 mW as calculated in equation 8. Therefore,
power dissipation is given no special attention.
Table 4 shows where the losses inside the converter are generated.
Table 4. Losses Inside the Converter
LOSSES
AMOUNTS
36 mW
Conduction losses in the switch
Switching losses
8 mW
Gate drive losses
2.3 mW
Quiescent current losses
<
1 mW
TOTAL
<
50 mW
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