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參數(shù)資料
| 型號： | TPS60111PWPR |
| 英文描述： | Analog IC |
| 中文描述： | 模擬IC |
| 文件頁數(shù)： | 21/22頁 |
| 文件大?。?/td> | 421K |
| 代理商： | TPS60111PWPR |
TPS60100
REGULATED 3.3 V 200-mA LOW-NOISE
CHARGE PUMP DC/DC CONVERTER
SLVS213B – MAY 1999 – REVISED SEPTEMBER 1999
21
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
MECHANICAL DATA
PWP (R-PDSO-G**)
PowerPAD
PLASTIC SMALL-OUTLINE PACKAGE
4073225/E 03/97
0,50
0,75
0,25
0,15 NOM
Thermal Pad
(See Note D)
Gage Plane
28
24
7,70
7,90
20
6,40
6,60
9,60
9,80
6,60
6,20
11
0,19
4,50
4,30
10
0,15
0,05
20
A
1
0,30
1,20 MAX
16
14
5,10
4,90
PINS **
4,90
5,10
DIM
A MIN
A MAX
Seating Plane
0,65
0,10
M
0,10
0
°
–8
°
20-PIN SHOWN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusions.
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This pad is electrically
and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MO-153
PowerPAD is a trademark of Texas Instruments Incorporated.
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