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參數(shù)資料
| 型號： | TPS54910PWPRG4 |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | 16 A SWITCHING REGULATOR, 762 kHz SWITCHING FREQ-MAX, PDSO28 |
| 封裝： | GREEN, PLASTIC, HTSSOP-28 |
| 文件頁數(shù)： | 3/21頁 |
| 文件大小： | 617K |
| 代理商： | TPS54910PWPRG4 |
TPS54910
SLVS421C MARCH 2002 REVISED FEBRUARY 2005
www.ti.com
11
LAYOUT CONSIDERATIONS FOR THERMAL
PERFORMANCE
For operation at full rated load current, the analog ground
plane must provide an adequate heat dissipating area. A
3-inch by 3-inch plane of 1 ounce copper is recommended,
though not mandatory, depending on ambient temperature
and airflow. Most applications have larger areas of internal
ground plane available, and the PowerPAD must be
connected to the largest area available. Additional areas
on the top or bottom layers also help dissipate heat, and
any area available must be used when 6 A or greater
operation is desired. Connection from the exposed area of
the PowerPAD to the analog ground plane layer must be
made using 0.013-inch diameter vias to avoid solder
wicking through the vias.
Eight vias must be in the PowerPAD area with four
additional vias located under the device package. The size
of the vias under the package, but not in the exposed
thermal pad area, can be increased to 0.018. Additional
vias beyond the twelve recommended that enhance
thermal performance must be included in areas not under
the device package.
Connect Pin 1 to Analog Ground Plane
in This Area for Optimum Performance
Minimum Recommended Top
Side Analog Ground Area
0.3478
0.0150
0.06
0.0256
0.1700
0.1340
0.0630
0.0400
0.0180
4 PL
0.2090
0.0130
8 PL
Minimum Recommended Exposed
Copper Area for Powerpad. 5mm
Stencils May Require 10 Percent
Larger Area
0.0650
0.0500
0.0650
0.0339
0.0500
Minimum Recommended Thermal Vias: 8 x 0.013 Diameter Inside
Powerpad Area 4 x 0.018 Diameter Under Device as Shown.
Additional 0.018 Diameter Vias May Be Used if Top Side Analog Ground
Area Is Extended.
0.3820
Figure 12. Recommended Land Pattern for 28-Pin PWP PowerPAD
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