參數(shù)資料
型號: TPS54373PWP
廠商: TEXAS INSTRUMENTS INC
元件分類: 穩(wěn)壓器
英文描述: 6 A SWITCHING REGULATOR, 762 kHz SWITCHING FREQ-MAX, PDSO20
封裝: GREEN, PLASTIC, HTSSOP-20
文件頁數(shù): 2/21頁
文件大?。?/td> 607K
代理商: TPS54373PWP
TPS54373
SLVS455B JANUARY 2003 REVISED FEBRUARY 2005
www.ti.com
10
AGND
BOOT
VSENSE
COMP
PWRGD
PH
RT
SYNC
SS/ENA
VBIAS
VIN
PGND
VOUT
PH
Vin
TOPSIDE GROUND AREA
VIA to Ground Plane
ANALOG GROUND TRACE
EXPOSED
COMPENSATION
NETWORK
OUTPUT INDUCTOR
OUTPUT
FILTER
CAPACITOR
BOOT
CAPACITOR
INPUT
BYPASS
CAPACITOR
SLOW START
CAPACITOR
OPTIONAL PRECHARGE DIODES
BIAS CAPACITOR
FREQUENCY SET RESISTOR
POWERPAD
AREA
INPUT
BULK
FILTER
Figure 11. TPS54373 PCB LAYOUT
LAYOUT CONSIDERATIONS FOR THERMAL
PERFORMANCE
For operation at full rated load current, the analog ground
plane must provide adequate heat dissipating area. A
3-inch by 3-inch plane of 1-ounce copper is
recommended, though not mandatory, depending on
ambient temperature and airflow. Most applications have
larger areas of internal ground plane available, and the
PowerPAD should be connected to the largest area
available. Additional areas on the top or bottom layers also
help dissipate heat, and any area available should be used
when 3-A or greater operation is desired. Connection from
the exposed area of the PowerPAD to the analog ground
plane layer should be made using 0.013-inch diameter
vias to avoid solder wicking through the vias. Six vias
should be in the PowerPAD area with four additional vias
located under the device package. The size of the vias
under the package, but not in the exposed thermal pad
area, can be increased to 0.018. Additional vias beyond
the ten recommended that enhance thermal performance
should be included in areas not under the device package.
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