參數(shù)資料
型號： TPS54290PWP
廠商： TEXAS INSTRUMENTS INC
元件分類： 穩(wěn)壓器
英文描述： 4.6 A DUAL SWITCHING CONTROLLER, 360 kHz SWITCHING FREQ-MAX, PDSO16
封裝： GREEN, PLASTIC, HTSSOP-16
文件頁數(shù)： 9/35頁
文件大?。?/td> 1397K
代理商： TPS54290PWP
( )
(
)
(
)
2
O
D(cond)
DS(on)LS
O
DS on HS
I
P
R
D R
1 D
I
12
D
÷
=
+
-
+
÷
è
(
)
(
)
(
)
2
IN
OSS
S
D(SW )
V
C
HS
C
LS
f
P
2
+
=
D
D(cond)output1
D(SW )output1
D(cond)output2
D(SW )output2
IN
P
V
Iq
=
+
(
)
J
A
D
TH(pkg)
TH(pad amb)
T
P
-
=
+
q
+ q
www.ti.com
SLUS973 – OCTOBER 2009
OVER-TEMPERATURE PROTECTION AND JUNCTION TEMPERATURE RISE
The over temperature thermal protection limits the maximum power to be dissipated at a given operating ambient
temperature. In other words, at a given device power dissipation, the maximum ambient operating temperature is
limited by the maximum allowable junction operating temperature. The device junction temperature is a function
of power dissipation, and the thermal impedance from the junction to the ambient. If the internal die temperature
should reach the thermal shutdown level, the TPS5429x shuts off both PWMs and remain in this state until the
die temperature drops below 125°C, at which time the device restarts.
The first step in determining the device junction temperature is to calculate the power dissipation. The power
dissipation is dominated by the two switching MOSFETs and the BP internal regulator. The power dissipated by
each MOSFET is composed of conduction losses and switching losses. The total conduction loss in the high side
and low side MOSFETs for each channel is given by Equation 12.
(12)
where
IO is the DC output current,
ΔIO is the peak-to-peak ripple current in the inductor
Notice the impact of operating duty cycle on the result.
The switching loss for each channal is approximated by Equation 13.
(13)
where
COSS(HS) is the output capacitance of the high-side MOSFET
COSS(LS) is the output capacitance of the low-side MOSFET
S is the switching frequency
The total power dissipation is found by summing the power loss for both MOSFETs plus the loss in the internal
regulator.
(14)
The temperature rise of the device junction is dependent on the thermal impedance from junction to the mounting
pad (See Package Dissipation Ratings), plus the thermal impedance from the thermal pad to ambient. The
thermal impedance from the thermal pad to ambient is dependent on the PCB layout (PowerPAD interface to the
PCB, the exposed pad area) and airflow (if any). See PCB Layout Guidelines, Additional References.
The operating junction temperature is shown in Equation 15.
(15)
where
θth is the thermal impedance
BYPASSING AND FILTERING
As with any integrated circuit, supply bypassing is important for jitter free operation. To improve the noise
immunity of the converter, ceramic bypass capacitors must be placed as close to the package as possible.
PVDD1 to GND – Use a 10 F ceramic capacitor
PVDD2 to GND – Use a 10 F ceramic capacitor
BP to GND – Use a 4.7 F Ceramic capacitor
Copyright 2009, Texas Instruments Incorporated
17
Product Folder Link(s) :TPS54290 TPS54291 TPS54292
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TPS54291EVM-431 功能描述:電源管理IC開發(fā)工具 Dual Sync Buck Con- verter Eval Mod RoHS:否 制造商:Maxim Integrated 產(chǎn)品:Evaluation Kits 類型:Battery Management 工具用于評估:MAX17710GB 輸入電壓: 輸出電壓:1.8 V
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TPS54291PWPR 功能描述:直流/直流開關(guān)調(diào)節(jié)器 4.5-18V Dual Sync Step Down Converter RoHS:否 制造商:International Rectifier 最大輸入電壓:21 V 開關(guān)頻率:1.5 MHz 輸出電壓:0.5 V to 0.86 V 輸出電流:4 A 輸出端數(shù)量: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFN 4 x 5
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