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參數(shù)資料
| 型號： | TPS40021PWPR |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | 0.01 A SWITCHING CONTROLLER, 1100 kHz SWITCHING FREQ-MAX, PDSO16 |
| 封裝： | GREEN, PLASTIC, HTSSOP-16 |
| 文件頁數(shù)： | 9/36頁 |
| 文件大?。?/td> | 724K |
| 代理商： | TPS40021PWPR |
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TPS40020
TPS40021
SLUS535D MARCH 2003 REVISED JULY 2007
www.ti.com
17
APPLICATION INFORMATION
Manufacturer’s instructions should be followed for proper layout of the external MOSFETs. Thermal
impedances given in the manufacturer’s datasheets are for a given mounting technique with a specified surface
area under the drain of the MOSFET. PowerPad package information can be found in the APPLICATION
INFORMATION section of this datasheet.
Refer to TPS40021 EVM001 High Efficiency Synchronous Buck Converter with PWM Controller Evaluation
Module (HPA009) User’s Guide, (Literature No. sluu144A) for a typical board layout.
The PowerPAD package provides low thermal impedance for heat removal from the device. The PowerPAD
derives its name and low thermal impedance from the large bonding pad on the bottom of the device. The circuit
board must have an area of solder-tinned-copper underneath the package. The dimensions of this area
depends on the size of the PowerPAD package. For a 16-pin TSSOP (PWP) package the area is
5 mm x 3.4 mm [3].
Thermal vias connect this area to internal or external copper planes and should have a drill diameter sufficiently
small so that the via hole is effectively plugged when the barrel of the via is plated with copper. This plug is
needed to prevent wicking the solder away from the interface between the package body and the solder-tinned
area under the device during solder reflow. Drill diameters of 0.33 mm (13 mils) works well when 1-oz copper
is plated at the surface of the board while simultaneously plating the barrel of the via. If the thermal vias are
not plugged when the copper plating is performed, then a solder mask material should be used to cap the vias
with a diameter equal to the via diameter of 0.1 mm minimum. This capping prevents the solder from being
wicked through the thermal vias and potentially creating a solder void under the package. Refer to PowerPAD
Thermally Enhanced Package[3] for more information on the PowerPAD package.
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| TPS40021PWPRG4 | 功能描述:DC/DC 開關控制器 Low Input Sync Buck Cntrlr source/sink RoHS:否 制造商:Texas Instruments 輸入電壓:6 V to 100 V 開關頻率: 輸出電壓:1.215 V to 80 V 輸出電流:3.5 A 輸出端數(shù)量:1 最大工作溫度:+ 125 C 安裝風格: 封裝 / 箱體:CPAK |
| TPS40022PWP | 制造商:Texas Instruments 功能描述: |
| TPS40040 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:LOW PIN COUNT, LOW VIN (2.5 V TO 5.5 V) SYNCHRONOUS BUCK DC-TO-DC CONTROLLER WITH ENABLE |
| TPS40040DRBR | 功能描述:DC/DC 開關控制器 Lo Vin Synch Buck DC/DC Cntrlr RoHS:否 制造商:Texas Instruments 輸入電壓:6 V to 100 V 開關頻率: 輸出電壓:1.215 V to 80 V 輸出電流:3.5 A 輸出端數(shù)量:1 最大工作溫度:+ 125 C 安裝風格: 封裝 / 箱體:CPAK |
| TPS40040DRBRG4 | 功能描述:DC/DC 開關控制器 Lo Vin Synch Buck DC/DC Cntrlr RoHS:否 制造商:Texas Instruments 輸入電壓:6 V to 100 V 開關頻率: 輸出電壓:1.215 V to 80 V 輸出電流:3.5 A 輸出端數(shù)量:1 最大工作溫度:+ 125 C 安裝風格: 封裝 / 箱體:CPAK |
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