
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
TPS3818G01DRVR
PREVIEW
SON
DRV
6
TBD
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TPS3818G01DRVT
PREVIEW
SON
DRV
6
TBD
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TPS3818G09DRVR
PREVIEW
SON
DRV
6
TBD
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TPS3818G09DRVT
PREVIEW
SON
DRV
6
TBD
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TPS3818G125DRVR
PREVIEW
SON
DRV
6
TBD
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TPS3818G125DRVT
PREVIEW
SON
DRV
6
TBD
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TPS3818G12DRVR
PREVIEW
SON
DRV
6
TBD
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TPS3818G12DRVT
PREVIEW
SON
DRV
6
TBD
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TPS3818G15DRVR
PREVIEW
SON
DRV
6
TBD
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TPS3818G15DRVT
PREVIEW
SON
DRV
6
TBD
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TPS3818G18DRVR
PREVIEW
SON
DRV
6
TBD
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TPS3818G18DRVT
PREVIEW
SON
DRV
6
TBD
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TPS3818G25DRVR
ACTIVE
SON
DRV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS3818G25DRVRG4
ACTIVE
SON
DRV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS3818G25DRVT
ACTIVE
SON
DRV
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS3818G25DRVTG4
ACTIVE
SON
DRV
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS3818G30DRVR
PREVIEW
SON
DRV
6
TBD
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TPS3818G30DRVT
PREVIEW
SON
DRV
6
TBD
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TPS3818G33DRVR
PREVIEW
SON
DRV
6
TBD
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TPS3818G33DRVT
PREVIEW
SON
DRV
6
TBD
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(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
PACKAGE OPTION ADDENDUM
www.ti.com
27-Mar-2009
Addendum-Page 1