參數(shù)資料
型號： TPS2330EVM-184
廠商： Texas Instruments, Inc.
英文描述： TPS2330 48-V Telecom Hot Swap Evaluation Module and Interface Card(48V遠(yuǎn)程通信熱交換電源控制器TPS2330的評估板與接口卡)
中文描述： TPS2330 48 - V電信熱插拔評估模塊和接口卡（48V的遠(yuǎn)程通信熱交換電源控制器TPS2330的評估板與接口卡）
文件頁數(shù)： 13/22頁
文件大?。?/td> 759K
代理商： TPS2330EVM-184
3-3
Schematics of the EVM and the Interface Card
The bills of materials (BOM) for both boards are shown in Tables 3
–
1 and 3
–
2,
respectively.
Table 3
–
1.Components on the Interface Card (SLVP155), Bill of Materials
Ref Des
Qty
Part Number
Description
Mfg
Size
C1, C2, C3
Not used
C4, C6
Not used
C5
1
12061C104KAT2A
Capacitor, ceramic, 0.1-
μ
F, 1100-V, +X7R, 10%, Y5V
Taiyo
Yuden
1210
C7, C8, C9
Not used
J3, J4
2
3267
Connector, banana jack, uninsulated
Pomona
J1,J2,J5, J6
Not used
P1
1
50
–
22SN
–
11
Connector, 44-pin edge w/mtg tabs (for 0.062
”
PCB)
Resistor, chip, 10 k
, 1/10 W, 5%
SW
–
1C
–
200 MA-SL
Cinch
R1, R2
Not used
Std
Std
1206
S1
Not used
EG1218
TP1
1
240
–
345
Test point, red, 1 mm
Farnell
TP5
1
240
–
333
Test point, black, 1 mm
Farnell
TP2
–
TP3
Not used
TP4,TP6
Not used
Key
1
50
–
PK
–
3
Key for P1 (Newark #57F3275)
Cinch
4
534
–
1804
Spacer, aluminum, 4
–
40 female, 0.625
”
long
Screw, pan head phillips, 4
–
40
×
0.25
”
Mouser
4
Table 3
–
2.Components on the 48-V Hot-Swap EVM (SLVP184), Bill of Materials
RefDes
Qty
Part Number
Description
Mfg
Size
C1
1
08055A102JAT2A
Capacitor, ceramic, 0.001-
μ
F, 50-V, COG, 5%
Capacitor, ceramic, 0.1-
μ
F, 25-V, X7R, 10%
Capacitor, ceramic, 0.1-
μ
F, 100-V, X7R, 10%
Capacitor, ceramic, 4.7-
μ
F, 35-V
Capacitor, OS-CON, 100-
μ
F, 100-V, 20%
Capacitor, ceramic, 0.1-
μ
F, 50-V, 10%
Connector, 44-pin dual edge PCB pattern
AVX
805
C3
1
GRM4034X7R104K50V
Murata
805
C2, C6, C7
3
12061C104KAT2A
AVX
1206
C4
1
GMK316F475Z
Taiyo-Yuden
1206
C5
1
SEK101M100ST
Sanyo
0.500
”
C8
1
C0805C104k5RAC
Kemet
805
P1
1
NA
NA
D1
1
1N4733A
Diode, Zener, 5.1-V, 49-mA, 1W
On Semi
DO-41
J1
1
PTC36SAAN
Header, 3-pin, 100-mil spacing, (36-pin strip)
Resistor, chip, 5.1 k
, 1/8-W, 1%
Resistor, chip, 33 k
, 1/10-W, 5%
Resistor, chip, 0-
, 1/8-W, 5%
Resistor, chip, 100 k
, 1/8-W, 5%
Resistor, chip, 890 k
, 1/8-W, 5%
Resistor, chip, 56 k
, 1/8-W, 5%
Sullins
R4
1
Std
Std
805
R6
1
Std
Std
805
R8
1
Std
Std
805
R3
1
Std
Std
805
R5
1
Std
Std
805
R1, R2, R7,
R10, R11,
R12, R13,
R14
8
Std
Std
1206
U1
1
TPS2330ID
IC, single hot-swap power controller w/circuit
breaker and PG
TI
SO14
TP5
1
240-333
Test point, black, 1 mm
Farnell
TP1-TP4,
TP6, TP7
6
240-345
Test point, red, 1 mm
Farnell
Q2
1
IRF530N
MOSFET, N-ch,100-V, 17A, .11-m
IRF
TO-22
0AB
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PDF描述
TPS2330EVM-185 TPS2330/TPS2331,TPS5102 InfiniBand SM Bulk Power Evalutation Module and Interface Card( InfiniBand SM 降壓電源管理器件TPS2330/TPS2331, TPS5102的評估板與接口卡)
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TPS2330EVM-185 功能描述:電源管理IC開發(fā)工具 Infiniband Bulk Pow Eval Mod RoHS:否 制造商:Maxim Integrated 產(chǎn)品:Evaluation Kits 類型:Battery Management 工具用于評估:MAX17710GB 輸入電壓: 輸出電壓:1.8 V
TPS2330ID 功能描述:熱插拔功率分布 3-13V Sngl w/Pwr Gd Rpt Act-Lo Enable RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube
TPS2330IDG4 功能描述:熱插拔功率分布 3-13V Sngl w/Pwr Gd Rpt Act-Lo Enable RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube
TPS2330IDR 功能描述:熱插拔功率分布 3-13V Sngl w/Pwr Gd Rpt Act-Lo Enable RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube
TPS2330IDRG4 功能描述:熱插拔功率分布 3-13V Sngl w/Pwr Gd Rpt Act-Lo Enable RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube
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