參數(shù)資料
型號： TPS2063DRG4
廠商： TEXAS INSTRUMENTS INC
元件分類： 電源管理
英文描述： 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO16
封裝： GREEN, PLASTIC, MS-012AC, SOIC-16
文件頁數(shù)： 9/40頁
文件大?。?/td> 1325K
代理商： TPS2063DRG4
GND
IN
EN1
EN2
OC1
OC2
OUT1
OUT2
TPS2062
Rpullup
V+
www.ti.com
SLVS490I – DECEMBER 2003 – REVISED OCTOBER 2009
Figure 26. Typical Circuit for the OC Pin
POWER DISSIPATION AND JUNCTION TEMPERATURE
The low on-resistance on the N-channel MOSFET allows the small surface-mount packages to pass large
currents. The thermal resistances of these packages are high compared to those of power packages; it is good
design practice to check power dissipation and junction temperature. Begin by determining the rDS(on) of the
N-channel MOSFET relative to the input voltage and operating temperature. As an initial estimate, use the
highest operating ambient temperature of interest and read rDS(on) from Figure 20. Using this value, the power
dissipation per switch can be calculated by:
PD = rDS(on)× I
2
Multiply this number by the number of switches being used. This step renders the total power dissipation from
the N-channel MOSFETs.
The thermal resistance, RθJA = 1 / (DERATING FACTOR), where DERATING FACTOR is obtained from the
Dissipation Ratings Table. Thermal resistance is a strong function of the printed circuit board construction , and
the copper trace area connecting the integrated circuit.
Finally, calculate the junction temperature:
TJ = PD x RθJA + TA
Where:
TA= Ambient temperature °C
RθJA = Thermal resistance
PD = Total power dissipation based on number of switches being used.
Compare the calculated junction temperature with the initial estimate. If they do not agree within a few degrees,
repeat the calculation, using the calculated value as the new estimate. Two or three iterations are generally
sufficient to get a reasonable answer.
THERMAL PROTECTION
Thermal protection prevents damage to the IC when heavy-overload or short-circuit faults are present for
extended periods of time. The TPS206x implements a thermal sensing to monitor the operating junction
temperature of the power distribution switch. In an overcurrent or short-circuit condition, the junction temperature
rises due to excessive power dissipation. Once the die temperature rises above a minimum of 135°C due to
overcurrent conditions, the internal thermal sense circuitry turns the power switch off, thus preventing the power
switch from damage. Hysteresis is built into the thermal sense circuit, and after the device has cooled
approximately 10°C, the switch turns back on. The switch continues to cycle in this manner until the load fault or
input power is removed. The OCx open-drain output is asserted (active low) when an overtemperature shutdown
or overcurrent occurs.
Copyright 2003–2009, Texas Instruments Incorporated
17
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