![](http://datasheet.mmic.net.cn/200000/TPS2052PE4_datasheet_15110745/TPS2052PE4_16.png)
TPS2042, TPS2052
DUAL POWER-DISTRIBUTION SWITCHES
SLVS173A – AUGUST 1998 – REVISED APRIL 1999
16
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
power dissipation and junction temperature
The low on-resistance on the n-channel MOSFET allows small surface-mount packages, such as SOIC, to pass
large currents. The thermal resistances of these packages are high compared to that of power packages; it is
good design practice to check power dissipation and junction temperature. The first step is to find rDS(on) at the
input voltage and operating temperature. As an initial estimate, use the highest operating ambient temperature
of interest and read rDS(on) from Figure 21. Next, calculate the power dissipation using:
P
D +
r
DS(on)
I2
Finally, calculate the junction temperature:
T
J +
P
D
RqJA ) TA
Where:
TA = Ambient Temperature °C
RθJA = Thermal resistance SOIC = 172°C/W, PDIP = 106°C/W
Compare the calculated junction temperature with the initial estimate. If they do not agree within a few degrees,
repeat the calculation, using the calculated value as the new estimate. Two or three iterations are generally
sufficient to get a reasonable answer.
thermal protection
Thermal protection prevents damage to the IC when heavy-overload or short-circuit faults are present for
extended periods of time. The faults force the TPS2042 and TPS2052 into constant current mode, which causes
the voltage across the high-side switch to increase; under short-circuit conditions, the voltage across the switch
is equal to the input voltage. The increased dissipation causes the junction temperature to rise to high levels.
The protection circuit senses the junction temperature of the switch and shuts it off. Hysteresis is built into the
thermal sense circuit, and after the device has cooled approximately 20 degrees, the switch turns back on. The
switch continues to cycle in this manner until the load fault or input power is removed.
The TPS2042 and TPS2052 implement a dual thermal trip to allow fully independent operation of the power
distribution switches. In an overcurrent or short-circuit condition the junction temperature will rise. Once the die
temperature rises to approximately 140
°C, the internal thermal sense circuitry checks which power switch is
in an overcurrent condition and turns that power switch off, thus isolating the fault without interrupting operation
of the adjacent power switch. Should the die temperature exceed the first thermal trip point of 140
°C and reach
160
°C, both switches turn off. The OC open-drain output is asserted (active low) when overtemperature or
overcurrent occurs.
undervoltage lockout (UVLO)
An undervoltage lockout ensures that the power switch is in the off state at power up. Whenever the input voltage
falls below approximately 2 V, the power switch will be quickly turned off. This facilitates the design of
hot-insertion systems where it is not possible to turn off the power switch before input power is removed. The
UVLO will also keep the switch from being turned on until the power supply has reached at least 2 V, even if
the switch is enabled. Upon reinsertion, the power switch will be turned on with a controlled rise time to reduce
EMI and voltage overshoots.