參數(shù)資料
型號： TPS2032P
廠商： Texas Instruments, Inc.
英文描述： POWER-DISTRIBUTION SWITCHES
中文描述： 配電開關
文件頁數(shù)： 5/25頁
文件大小： 470K
代理商： TPS2032P
SLVS190B DECEMBER 1998 REVISED MARCH 2004
5
TI.COM
electrical characteristics over recommended operating junction temperature range, V
I(IN)
= 5.5 V,
I
O
= rated current, EN = 5 V (unless otherwise noted)
power switch
PARAMETER
TEST CONDITIONS
TJ = 25
°
C,
TJ = 85
°
C,
TJ = 125
°
C,
TJ = 25
°
C,
TJ = 85
°
C,
TJ = 125
°
C,
TJ = 25
°
C,
TJ = 85
°
C,
TJ = 125
°
C,
TJ = 25
°
C,
TJ = 85
°
C,
TJ = 125
°
C,
TJ = 25
°
C,
RL = 10
TJ = 25
°
C,
RL = 10
TJ = 25
°
C,
RL = 10
TJ = 25
°
C,
RL = 10
MIN
TYP
MAX
UNIT
VI(IN) = 5 V,
VI(IN) = 5 V,
VI(IN) = 5 V,
VI(IN) = 3.3 V,
VI(IN) = 3.3 V,
VI(IN) = 3.3 V,
VI(IN) = 5 V,
VI(IN) = 5 V,
VI(IN) = 5 V,
VI(IN) = 3.3 V,
VI(IN) = 3.3 V,
VI(IN) = 3.3 V,
VI(IN) = 5.5 V,
CL = 1
μ
F,
VI(IN) = 2.7 V,
CL = 1
μ
F,
VI(IN) = 5.5 V,
CL = 1
μ
F,
VI(IN) = 2.7 V,
CL = 1
μ
F,
IO = 1.8 A
IO = 1.8 A
IO = 1.8 A
IO = 1.8 A
IO = 1.8 A
IO = 1.8 A
IO = 0.18 A
IO = 0.18 A
IO = 0.18 A
IO = 0.18 A
IO = 0.18 A
IO = 0.18 A
33
36
38
46
44
50
37
41
43
52
rDS(on)
Static drain-source on-state resistance
51
61
m
30
34
35
41
39
47
33
37
39
46
44
56
tr
Rise time, output
6.1
ms
8.6
tf
Fall time, output
3.4
ms
3
Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.
enable input (EN)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VIH
High-level input voltage
2.7 V
≤
VI(IN)
≤
5.5 V
4.5 V
≤
VI(IN)
≤
5.5 V
2.7 V
≤
VI(IN)
≤
4.5 V
EN = 0 V or EN = VI(IN)
CL = 100
μ
F, RL = 10
CL = 100
μ
F, RL = 10
2
V
VIL
Low-level input voltage
0.8
V
0.5
II
Input current
0.5
0.5
μ
A
ton
toff
Turnon time
Turnoff time
20
40
ms
current limit
PARAMETER
TEST CONDITIONS
MIN
0.22
TYP
0.3
MAX
0.4
UNIT
TPS2030
TJ = 25
°
C, VI = 5.5 V,
Device enable into short circuit
TPS2031
0.66
0.9
1.1
IOS
Short-circuit output current
TPS2032
1.1
1.5
1.8
A
OUT connected to GND,
TPS2033
TPS2034
1.65
2.2
2.2
2.7
3.8
3
Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.
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