參數(shù)資料
型號: TPS2023DR
英文描述: PERIPHERAL DRIVER|1 DRIVER|MOS|SOP|8PIN|PLASTIC
中文描述: 外圍設(shè)備驅(qū)動程序| 1驅(qū)動器|馬鞍山|??苵 8引腳|塑料
文件頁數(shù): 21/22頁
文件大小: 356K
代理商: TPS2023DR
TPS2010A, TPS2011A, TPS2012A, TPS2013A
POWER-DISTRIBUTION SWITCHES
SLVS189A – DECEMBER 1998 – REVISED NOVEMBER 1999
21
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
MECHANICAL DATA
PWP (R-PDSO-G**)
PowerPAD
PLASTIC SMALL-OUTLINE PACKAGE
4073225/E 03/97
0,50
0,75
0,25
0,15 NOM
Thermal Pad
(See Note D)
Gage Plane
28
24
7,70
7,90
20
6,40
6,60
9,60
9,80
6,60
6,20
11
0,19
4,50
4,30
10
0,15
0,05
20
A
1
0,30
1,20 MAX
16
14
5,10
4,90
PINS **
4,90
5,10
DIM
A MIN
A MAX
Seating Plane
0,65
0,10
M
0,10
0
°
–8
°
20-PIN SHOWN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusions.
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This pad is electrically
and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MO-153
PowerPAD is a trademark of Texas Instruments Incorporated.
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