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| 型號： | TPPM0310 |
| 英文描述： | Analog IC |
| 中文描述： | 模擬IC |
| 文件頁數(shù)： | 5/8頁 |
| 文件大?。?/td> | 106K |
| 代理商： | TPPM0310 |
TPPM0301
400-mA LOW-DROPOUT REGULATOR
WITH AUXILIARY POWER MANAGEMENT
SLVS315 – SEPTEMBER 2000
5
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
THERMAL INFORMATION
To ensure reliable operation of the device, the junction temperature of the output device must be within the safe
operating area (SOA). This is achieved by having a means to dissipate the heat generated from the junction
of the output structure. There are two components that contribute to thermal resistance. They consist of two
paths in series. The first is the junction to case thermal resistance, R
θ
JC
; the second is the case to ambient
thermal resistance, R
θ
CA
. The overall junction to ambient thermal resistance, R
θ
JA
, is determined by:
R
θ
JA
= R
θ
JC
+ R
θ
CA
The ability to efficiently dissipate the heat from the junction is a function of the package style and board layout
incorporated in the application. The operating junction temperature is determined by the operating ambient
temperature, T
A
, and the junction power dissipation, P
J
.
The junction temperature, T
J
, is equal to the following thermal equation:
T
J
= T
A
+ P
J
(R
θ
JC
) + P
J
(R
θ
CA
)
T
J
= T
A
+ P
J
(R
θ
JA
)
This particular application uses the enhanced 8-pin SO package with an integral fused lead frame (terminals
5 to 8). By incorporating a dedicated heat spreading copper plane of at least two square inches on a double-side
printed-circuit board (PCB), a thermal resistance of junction to ambient, R
θ
JA
, of 50
°
C/W can be obtained.
Alternatively, if no dedicated copper plane is incorporated for this device and the PCB has a multilayer
construction, the ground terminals (5 to 8) could be electrically connected to the ground plane of the board. This
will provide a means for heat spreading through the copper plane associated within the PCB (GND layer). This
concept could provide a thermal resistance from junction to ambient, R
θ
JA
, of 70
°
C/W if implemented correctly.
Hence, maximum power dissipation allowable for an operating ambient temperature of 70
°
C, and a maximum
junction temperature of 150
°
C is determined as:
P
J
= (T
J
– T
A
) / R
θ
JA
P
J
= (150 – 70) / 50 = 1.6 W
Using two square inches of dedicated copper plane on double-sided PCB,
P
J
= (150 – 70) / 70 = 1.14 W
Using a multilayer board and utilizing the ground plane for heat spreading, worst case maximum power
dissipation is determined by:
P
D
= (5.5 – 3)
×
0.4 = 1 W
Normal operating maximum power dissipation is (see Figure 1):
P
D
= (5 – 3.3)
×
0.4 = 0.68 W
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