參數(shù)資料
型號(hào)： TPA751DR
元件分類： 音頻放大器
英文描述： Amplifier. Other
中文描述： 放大器。其他
文件頁(yè)數(shù)： 2/22頁(yè)
文件大?。?/td> 336K
代理商： TPA751DR
TPA721
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER
SLOS231D
–
NOVEMBER 1998
–
REVISED OCTOBER 2002
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
AVAILABLE OPTIONS
PACKAGED DEVICES
MSOP
TA
SMALL OUTLINE
(D)
MSOP
(DGN)
SYMBOLIZATION
–
40
°
C to 85
°
C
In the D package, the maximum output power is thermally limited to 350 mW; 700 mW peaks can be
driven, as long as the RMS value is less than 350 mW.
The D and DGN packages are available taped and reeled. To order a taped and reeled part, add the
suffix R to the part number (e.g., TPA301DR).
TPA721D
TPA721DGN
ABC
Terminal Functions
TERMINAL
NAME
I/O
DESCRIPTION
NO.
BYPASS
2
I
BYPASS is the tap to the voltage divider for internal mid-supply bias. This terminal should be connected
to a 0.1-
μ
F to 2.2-
μ
F capacitor when used as an audio amplifier.
GND is the ground connection.
IN
–
is the inverting input. IN
–
is typically used as the audio input terminal.
IN+ is the noninverting input. IN+ is typically tied to the BYPASS terminal.
SHUTDOWN places the entire device in shutdown mode when held high (IDD < 7
μ
A).
VDD is the supply voltage terminal.
VO+ is the positive BTL output.
VO
–
is the negative BTL output.
GND
IN
–
IN+
SHUTDOWN
VDD
VO+
VO
–
7
4
3
1
6
5
8
I
I
I
O
O
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
§
Supply voltage, V
DD
Input voltage, V
I
Continuous total power dissipation
Operating free-air temperature range, T
A
Operating junction temperature range, T
J
Storage temperature range, T
stg
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
6 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Internally limited (see Dissipation Rating Table)
. . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
–
0.3 V to V
DD
+0.3 V
–
40
°
C to 85
°
C
–
40
°
C to 150
°
C
–
65
°
C to 150
°
C
260
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
§
Stresses beyond those listed under
“
absolute maximum ratings
”
may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under
“
recommended operating conditions
”
is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATING TABLE
PACKAGE
D
DGN
Please see the Texas Instruments document,
PowerPAD Thermally Enhanced Package Application Report
(SLMA002), for more information on the PowerPAD package. The thermal data was measured on a PCB
layout based on the information in the section entitled
Texas Instruments Recommended Board for PowerPAD
on page 33 of that document.
TA
≤
25
°
C
725 mW
2.14 W
DERATING FACTOR
5.8 mW/
°
C
17.1 mW/
°
C
TA = 70
°
C
464 mW
1.37 W
TA = 85
°
C
377 mW
1.11 W
recommended operating conditions
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Operating free-air temperature, TA
0.1VDD
–
40
ááá
ááá
ááá
V
85
°
C
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