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參數(shù)資料
| 型號： | TPA321DR |
| 元件分類： | 音頻放大器 |
| 英文描述： | Single Audio Amplifier |
| 中文描述： | 單音頻放大器 |
| 文件頁數(shù)： | 2/22頁 |
| 文件大小： | 424K |
| 代理商： | TPA321DR |
TPA321
350-mW MONO AUDIO POWER AMPLIFIER
WITH DIFFERENTIAL INPUTS
SLOS312A – JUNE 2000 – REVISED JUNE 2000
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
AVAILABLE OPTIONS
PACKAGED DEVICES
MSOP
TA
SMALL OUTLINE
(D)
MSOP
(DGN)
SYMBOLIZATION
–40
°
C to 85
°
C
The D and DGN packages are available taped and reeled. To order a taped and reeled part, add
the suffix R to the part number (e.g., TPA321DR).
TPA321D
TPA321DGN
AJB
Terminal Functions
TERMINAL
NAME
I/O
DESCRIPTION
NO.
BYPASS
2
I
BYPASS is the tap to the voltage divider for internal mid-supply bias. This terminal should be connected to
a 0.1-
μ
F to 1-
μ
F capacitor when used as an audio amplifier.
GND
7
GND is the ground connection.
IN–
4
I
IN– is the inverting input. IN– is typically used as the audio input terminal.
IN+
3
I
IN+ is the noninverting input. IN+ is typically tied to the BYPASS terminal for SE operations.
SHUTDOWN places the entire device in shutdown mode when held high (IDD < 1
μ
A).
VDD is the supply voltage terminal.
VO+ is the positive BTL output.
VO– is the negative BTL output.
SHUTDOWN
1
I
VDD
VO+
VO–
6
5
O
8
O
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, V
DD
Input voltage, V
I
Continuous total power dissipation
Operating free-air temperature range, T
A
Operating junction temperature range, T
J
Storage temperature range, T
stg
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
6 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
internally limited (see Dissipation Rating Table)
. . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
–0.3 V to V
DD
+0.3 V
–40
°
C to 85
°
C
–40
°
C to 150
°
C
–65
°
C to 150
°
C
260
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATING TABLE
PACKAGE
TA
≤
25
°
C
725 mW
2.14 W§
DERATING FACTOR
5.8 mW/
°
C
TA = 70
°
C
464 mW
TA = 85
°
C
377 mW
D
DGN
17.1 mW/
°
C
1.37 W
1.11 W
§Please see the Texas Instruments document, PowerPAD Thermally Enhanced Package Application Report
(literature number SLMA002), for more information on the PowerPAD
package. The thermal data was
measured on a PCB layout based on the information in the section entitled Texas Instruments Recommended
Board for PowerPADon page 33 of the before mentioned document.
recommended operating conditions
MIN
MAX
UNIT
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Supply voltage, VDD
2.5
5.5
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V
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