參數(shù)資料
型號(hào): TPA3000D1PWPR
英文描述: Tactile Switch; Operating Force Max:1.85N; Circuitry:SPST-NO; Switch Operation:(On); Actuator Style:Button; Contact Current Max:50mA; Mounting Type:PCB Surface Mount; Size/Dimensions:2.7 x 8.05 mm; Switch Function:SPST-NO
中文描述: 音頻放大器|單|的CMOS | TSSOP封裝| 20針|塑料
文件頁數(shù): 18/19頁
文件大小: 261K
代理商: TPA3000D1PWPR
MECHANICAL DATA
MHTS001D
JANUARY 1995
REVISED MAY 1999
18
www.ti.com
MECHANICAL DATA
PWP (R-PDSO-G**)
PowerPAD
PLASTIC SMALL-OUTLINE
4073225/F 10/98
0,50
0,75
0,25
0,15 NOM
Thermal Pad
(See Note D)
Gage Plane
28
24
7,70
7,90
20
6,40
6,60
9,60
9,80
6,60
6,20
11
0,19
4,50
4,30
10
0,15
0,05
20
A
1
0,30
1,20 MAX
16
14
5,10
4,90
PINS **
4,90
5,10
DIM
A MIN
A MAX
Seating Plane
0,65
0,10
M
0,10
0
°
8
°
20 PINS SHOWN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusions.
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.
This pad is electrically and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MO-153
PowerPAD is a trademark of Texas Instruments.
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