參數(shù)資料
型號: TPA2008D2PWPR
廠商: Texas Instruments
文件頁數(shù): 20/26頁
文件大?。?/td> 0K
描述: IC AMP AUDIO PWR 3W STER 24TSSOP
標準包裝: 1
類型: D 類
輸出類型: 2 通道(立體聲)
在某負載時最大輸出功率 x 通道數(shù)量: 3W x 2 @ 3 歐姆
電源電壓: 4.5 V ~ 5.5 V
特點: 消除爆音,差分輸入,短路和熱保護,關機,音量控制
安裝類型: 表面貼裝
供應商設備封裝: 24-HTSSOP
封裝/外殼: 24-TSSOP(0.173",4.40mm)裸露焊盤
包裝: 標準包裝
配用: 296-18922-ND - EVAL MODULE FOR TPA2008D2
其它名稱: 296-17158-6
www.ti.com
TPA2008D2
SLOS413C – JULY 2003 – REVISED MAY 2004
TERMINAL FUNCTIONS
TERMINAL
I/O
DESCRIPTION
NO.
NAME
AGND
12
-
Analog ground
BYPASS
22
I
Tap to voltage divider for internal mid-supply bias generator used for internal analog reference.
COSC
10
I
A capacitor connected to this terminal sets the oscillation frequency in conjunction with ROSC. For
proper operation, connect a 220-pF capacitor from COSC to ground.
LINN
1
I
Negative differential audio input for left channel
LINP
2
I
Positive differential audio input for left channel
LOUTN
8
O
Negative audio output for left channel
LOUTP
5
O
Positive audio output for left channel
NC
15
I
No connection
PGNDL
6, 7
-
Power ground for left channel H-bridge
PGNDR
18, 19
-
Power ground for right channel H-bridge
PVDDL
4, 9
Power supply for left channel H-bridge
PVDDR
16, 21
Power supply for right channel H-bridge
RINN
24
I
Positive differential audio input for right channel
RINP
23
I
Negative differential audio input for right channel
ROSC
11
I
A resistor connected to the ROSC terminal sets the oscillation frequency in conjunction with COSC. For
proper operation, connect a 120-k
resistor from ROSC to ground.
ROUTN
17
O
Negative output for right channel
ROUTP
20
O
Positive output for right channel
SHUTDOWN
3
I
Places the amplifer in shutdown mode if a TTL logic low is placed on this terminal; normal operation if a
TTL logic high is placed on this terminal.
VDD
13
-
Analog power supply
VOLUME
14
I
DC volume control for setting the gain on the internal amplifiers. The dc voltage range is 0 to VDD.
Thermal Pad
-
Connect to analog ground and the power grounds must be soldered down in all applications to properly
secure device on the PCB.
3
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