- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄98268 > TPA0212PWPG4 (TEXAS INSTRUMENTS INC) 2.6 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO24 PDF資料下載
參數(shù)資料
| 型號： | TPA0212PWPG4 |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 2.6 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO24 |
| 封裝： | GREEN, PLASTIC, HTSSOP-24 |
| 文件頁數(shù)： | 9/37頁 |
| 文件大?。?/td> | 923K |
| 代理商： | TPA0212PWPG4 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁當(dāng)前第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁
www.ti.com
THERMAL INFORMATION
DIE
Side View (a)
End View (b)
Bottom View (c)
DIE
Thermal
Pad
TPA0212
SLOS284B – NOVEMBER 1999 – REVISED NOVEMBER 2004
The thermally enhanced PWP package is based on the 24-pin TSSOP, but includes a thermal pad (see
Figure 41) to provide an effective thermal contact between the IC and the PWB.
Traditionally, surface mount and power have been mutually exclusive terms. A variety of scaled-down
TO-220-type packages have leads formed as gull wings to make them applicable for surface-mount applications.
These packages, however, have only two shortcomings: they do not address the low profile (< 2 mm)
requirements of many of today's advanced systems, and they do not offer a terminal-count high enough to
accommodate increasing integration. On the other hand, traditional low-power surface-mount packages require
power-dissipation derating that severely limits the usable range of many high-performance analog circuits.
The PowerPAD package (thermally enhanced TSSOP) combines fine-pitch surface-mount technology with
thermal performance comparable to much larger power packages.
The PowerPAD package is designed to optimize the heat transfer to the PWB. Because of the small size and
limited mass of a TSSOP package, thermal enhancement is achieved by improving the thermal conduction paths
that remove heat from the component. The thermal pad is formed using a patented lead-frame design and
manufacturing technique to provide a direct connection to the heat-generating IC. When this pad is soldered or
otherwise thermally coupled to an external heat dissipator, high power dissipation in the ultrathin, fine-pitch,
surface-mount package can be reliably achieved.
Figure 41. Views of Thermally Enhanced PWP Package
17
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TPA0212PWPR | 2 CHANNEL(S), VOLUME CONTROL CIRCUIT, PDSO24 |
| TPA0212PWP | 2 CHANNEL(S), VOLUME CONTROL CIRCUIT, PDSO24 |
| TPA0212PWPRG4 | 2 CHANNEL(S), VOLUME CONTROL CIRCUIT, PDSO24 |
| TPA0222PWPG4 | 2 CHANNEL(S), VOLUME CONTROL CIRCUIT, PDSO24 |
| TPA0222PWPR | 2 CHANNEL(S), VOLUME CONTROL CIRCUIT, PDSO24 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TPA0212PWPR | 功能描述:音頻放大器 Stereo Class-AB w/Ster Hdphn Drive RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TPA0212PWPRG4 | 功能描述:音頻放大器 Stereo Class-AB w/Ster Hdphn Drive RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TPA0213 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:2-W MONO AUDIO POWER AMPLIFIER WITH HEADPHONE DRIVE |
| TPA0213_07 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:2-W MONO AUDIO POWER AMPLIFIER WITH HEADPHONE DRIVE |
| TPA0213DGQ | 功能描述:音頻放大器 Mono Class-AB w/Ster Hdphn Drive RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。