參數(shù)資料
型號: TMS320LC549GGU
廠商: Texas Instruments, Inc.
元件分類: 熱敏電阻
英文描述: SENSOR, MINIATURE, NTC, 3K; Series:B578; Thermistor type:NTC; Resistance:3kR; Beta value:3988; Temperature, lower limit, beta value:25(degree C); Temperature, upper limit, beta value:100(degree C); Temp, op. max:155(degree C); Case RoHS Compliant: Yes
中文描述: 定點數(shù)字信號處理器
文件頁數(shù): 92/123頁
文件大?。?/td> 1205K
代理商: TMS320LC549GGU
www.ti.com
t
h(boot-mode)(A)
t
w(RSL2)
XCLKIN
X1/X2
XRS
Boot-Mode
Pins
XCLKOUT
I/O Pins
Address/Data/
Control
(Internal)
Boot-ROM Execution Starts
User-Code Execution Starts
User-Code Dependent
User-Code Execution Phase
(Don’t Care)
User-Code Dependent
User-Code Execution
Peripheral/GPIO Function
User-Code Dependent
GPIO Pins as Input (State Depends on Internal PU/PD)
GPIO Pins as Input
Peripheral/GPIO Function
t
d(EX)
OSCCLK * 5
OSCCLK/8
TMS320F2808, TMS320F2806
TMS320F2801, UCD9501
Digital Signal Processors
SPRS230F–OCTOBER 2003–REVISED SEPTEMBER 2005
Table 6-11. Reset (XRS) Timing Requirements
MIN
NOM
MAX
UNIT
cycles
cycles
t
w(RSL1)(1)
t
w(RSL2)
Pulse duration, stable XCLKIN to XRS high
Pulse duration, XRS low
Pulse duration, reset pulse generated by
watchdog
Delay time, address/data valid after XRS high
Oscillator start-up time
Hold time for boot-mode pins
8t
c(OSCCLK)
8t
c(OSCCLK)
Warm reset
t
w(WDRS)
512t
c(OSCCLK)
cycles
t
d(EX)
t
OSCST(2)
t
h(boot-mode)
(1)
In addition to the t
requirement, XRS has to be low at least for 1 ms after V
DD
reaches 1.5 V.
(2)
Dependent on crystal/resonator and board design.
32t
c(OSCCLK)
cycles
ms
cycles
1
10
200t
c(OSCCLK)
A.
After reset, the Boot ROM code samples BOOT Mode pins. Based on the status of the Boot Mode pin, the boot code
branches to destination memory or boot code function. If Boot ROM code executes after power-on conditions (in
debugger environment), the Boot code execution time is based on the current SYSCLKOUT speed. The
SYSCLKOUT will be based on user environment and could be with or without PLL enabled.
Figure 6-6. Warm Reset
Figure 6-7
shows an example for the effect of writing into PLLCR register. In the first phase, PLLCR =
0x0004 and SYSCLKOUT = OSCCLK x 2. The PLLCR is then written with 0x0008. Right after the PLLCR
register is written, the PLL lock-up phase begins. During this phase, SYSCLKOUT = OSCCLK/2. After the
PLL lock-up is complete (which takes 131072 OSCCLK cycles), SYSCLKOUT reflects the new operating
frequency, OSCCLK x 4.
92
Electrical Specifications
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TMS320LC549PGE-66 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC Dig Signal Proc RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
TMS320LC549PGE-80 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC Dig Signal Proc RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT