參數(shù)資料
型號(hào)： TMS320C6727B_07
廠商： Texas Instruments, Inc.
元件分類： 數(shù)字信號(hào)處理
英文描述： Floating-Point Digital Signal Processors
中文描述： 浮點(diǎn)數(shù)字信號(hào)處理器
文件頁數(shù)： 109/116頁
文件大?。?/td> 999K
代理商： TMS320C6727B_07
www.ti.com
7.2 Supplementary Information About the 144-Pin RFP PowerPAD Package
7.2.1
Standoff Height
Standoff Height
TMS320C6727B, TMS320C6726B, TMS320C6722B, TMS320C6720
Floating-Point Digital Signal Processors
SPRS370C–SEPTEMBER 2006–REVISED OCTOBER 2007
This section highlights a few important details about the 144-pin RFP PowerPAD package. Texas
Instruments'
PowerPAD Thermally Enhanced Package Technical Brief
(literature number SLMA002)
should be consulted before designing a PCB for this device.
As illustrated in
Figure 7-1
, the standoff height specification for this device (between 0.050 mm and
0.150 mm) is measured from the seating plane established by the three lowest package pins to the
lowest
point on the package body. Due to warpage, the lowest point on the package body is located in the center
of the package at the exposed thermal pad.
Using this definition of standoff height provides the correct result for determining the correct solder paste
thickness. According to TI's
PowerPAD Thermally Enhanced Package Technical Brief
(literature number
SLMA002), the recommended range of solder paste thickness for this package is between 0.152 mm and
0.178 mm.
Figure 7-1. Standoff Height Measurement on 144-Pin RFP Package
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Mechanical Data
109
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