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      參數(shù)資料
      型號: TMS320C6211GGPA167
      廠商: Texas Instruments, Inc.
      英文描述: AC 3C 3#16S SKT PLUG
      中文描述: 定點數(shù)字信號處理器
      文件頁數(shù): 17/123頁
      文件大小: 1205K
      代理商: TMS320C6211GGPA167
      www.ti.com
      TMS320F2808, TMS320F2806
      TMS320F2801, UCD9501
      Digital Signal Processors
      SPRS230F–OCTOBER 2003–REVISED SEPTEMBER 2005
      Table 2-2. Signal Descriptions
      PIN NO.
      NAME
      DESCRIPTION
      (1)
      PZ PIN
      #
      GGM
      BALL #
      JTAG
      JTAG test reset with internal pulldown. TRST, when driven high, gives the scan system control of
      the operations of the device. If this signal is not connected or driven low, the device operates in its
      functional mode, and the test reset signals are ignored.
      NOTE: Do not use pullup resistors on TRST; it has an internal pull-down device. TRST is an active
      high test pin and must be maintained low at all times during normal device operation. In a low-noise
      environment, TRST may be left floating. In other instances, an external pulldown resistor is
      highly
      recommended
      . The value of this resistor should be based on drive strength of the debugger pods
      applicable to the design. A 2.2-k
      resistor generally offers adequate protection. Since this is
      application-specific, it is recommended that each target board is validated for proper operation of
      the debugger and the application. (I,
      )
      JTAG test clock with internal pullup (I,
      )
      JTAG test-mode select (TMS) with internal pullup. This serial control input is clocked into the TAP
      controller on the rising edge of TCK. (I,
      )
      JTAG test data input (TDI) with internal pullup. TDI is clocked into the selected register (instruction
      or data) on a rising edge of TCK. (I,
      )
      JTAG scan out, test data output (TDO). The contents of the selected register (instruction or data)
      are shifted out of TDO on the falling edge of TCK. (O/Z 8 mA drive)
      Emulator pin 0. When TRST is driven high, this pin is used as an interrupt to or from the emulator
      system and is defined as input/output through the JTAG scan. (I/O/Z, 8 mA drive
      )
      Emulator pin 1. When TRST is driven high, this pin is used as an interrupt to or from the emulator
      system and is defined as input/output through the JTAG scan. (I/O/Z, 8 mA drive,
      )
      FLASH
      3.3-V Flash Core Power Pin. This pin should be connected to 3.3 V at all times.
      Test Pin. Reserved for TI. Must be left unconnected. (I/O)
      Test Pin. Reserved for TI. Must be left unconnected. (I/O)
      CLOCK
      Output clock derived from SYSCLKOUT. XCLKOUT is either the same frequency, one-half the
      frequency, or one-fourth the frequency of SYSCLKOUT. This is controlled by the bits 1, 0
      (XCLKOUTDIV) in the XCLK register. At reset, XCLKOUT = SYSCLKOUT/4. The XCLKOUT signal
      can be turned off by setting XCLKOUTDIV to 3. Unlike other GPIO pins, the XCLKOUT pin is not
      placed in high-impedance state during a reset. (O/Z, 8 mA drive).
      External Oscillator Input. This pin is to feed a clock from an external 3.3-V oscillator. In this case,
      the X1 pin must be tied to GND. If a crystal/resonator is used (or if an external 1.8-V oscillator is
      used to feed clock to X1 pin), this pin must be tied to GND. (I)
      Internal/External Oscillator Input. To use the internal oscillator, a quartz crystal or a ceramic
      resonator may be connected across X1 and X2. The X1 pin is referenced to the 1.8-V core digital
      power supply. A 1.8-V external oscillator may be connected to the X1 pin. In this case, the XCLKIN
      pin must be connected to ground. If a 3.3-V external oscillator is used with the XCLKIN pin, X1 must
      be tied to GND. (I)
      Internal Oscillator Output. A quartz crystal or a ceramic resonator may be connected across X1 and
      X2. If X2 is not used it must be left unconnected. (O)
      RESET
      Device Reset (in) and Watchdog Reset (out).
      Device reset. XRS causes the device to terminate execution. The PC will point to the address
      contained at the location 0x3FFFC0. When XRS is brought to a high level, execution begins at the
      location pointed to by the PC. This pin is driven low by the DSP when a watchdog reset occurs.
      During watchdog reset, the XRS pin is driven low for the watchdog reset duration of 512 OSCCLK
      cycles. (I/OD,
      )
      The output buffer of this pin is an open-drain with an internal pullup (100
      μ
      A, typical). It is
      recommended that this pin be driven by an open-drain device.
      ADC SIGNALS
      ADC Group A, Channel 7 input (I)
      ADC Group A, Channel 6 input (I)
      TRST
      84
      A6
      TCK
      75
      A10
      TMS
      74
      B10
      TDI
      73
      C9
      TDO
      76
      B9
      EMU0
      80
      A8
      EMU1
      81
      B7
      VDD3VFL
      TEST1
      TEST2
      96
      97
      98
      C4
      A3
      B3
      XCLKOUT
      66
      E8
      XCLKIN
      90
      B5
      X1
      88
      E6
      X2
      86
      C6
      XRS
      78
      B8
      ADCINA7
      ADCINA6
      16
      17
      F3
      F4
      (1)
      I = Input, O = Output, Z = High impedance, OD = Open drain,
      = Pullup,
      = Pulldown
      Introduction
      17
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