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參數(shù)資料
| 型號(hào)： | TMP95CU54AF |
| 廠商： | Toshiba Corporation |
| 元件分類： | 微控制器 |
| 英文描述： | Quality And Reliability Assurance / Handling Precautions |
| 中文描述： | 質(zhì)量與可靠性保證/操作注意事項(xiàng) |
| 文件頁數(shù)： | 43/48頁 |
| 文件大小： | 390K |
| 代理商： | TMP95CU54AF |
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Quality and Reliability Assurance / Handling Precautions
030901
QUA-43
2002-02-20
4.5.3 Soldering Temperature Profile
The soldering temperature and heating time vary from device to device.
Therefore, when specifying the mounting conditions, refer to the individual
datasheets and databooks for the devices used.
(1)
Using a Soldering Iron
Complete soldering within ten seconds for lead temperatures of up to
260°C, or within three seconds for lead temperatures up to 350°C.
(2)
Standard Mounting Conditions for SMDs
(Surface Mount Devices)
For details, refer to section 2.1 Mounting Precautions in chapter 2
Handling Precautions for Microcontrollers.
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| TMP95CW54AF | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:Quality And Reliability Assurance / Handling Precautions |
| TMP95CW64 | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:CMOS 16-Bit Microcontroller |
| TMP95CW64F | 制造商:Toshiba America Electronic Components 功能描述:MCU 16BIT TLCS-900 CISC 128KB ROM 5V 100LQFP - Tape and Reel |
| TMP95CW65 | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:CMOS 16-Bit Microcontroller |
| TMP95CW65F | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:Quality And Reliability Assurance / Handling Precautions |
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