參數(shù)資料
型號(hào)： TMP94FU81F
廠商： Toshiba Corporation
英文描述： Quality And Reliability Assurance / Handling Precautions
中文描述： 質(zhì)量與可靠性保證/操作注意事項(xiàng)
文件頁(yè)數(shù)： 44/48頁(yè)
文件大?。?/td> 390K
代理商： TMP94FU81F
Quality and Reliability Assurance / Handling Precautions
030901
QUA-44
2002-02-20
4.5.4 Flux Cleaning and Ultrasonic Cleaning
(1)
When cleaning circuit boards to remove flux, make sure that no residual
reactive ions such as Na or Cl remain. Note that organic solvents react
with water to generate hydrogen chloride and other corrosive gases which
can degrade device performance.
Washing devices with water will not cause any problems. However, make
sure that no reactive ions such as sodium and chlorine are left as residues.
Also, be sure to dry devices sufficiently after washing.
Do not rub device markings with a brush or with your hand during
cleaning or while the devices are still wet from the cleaning agent. Doing
so can rub off the markings.
The dip cleaning, shower cleaning and steam cleaning processes all
involve the chemical action of a solvent. Use only recommended solvents
for these cleaning methods. When immersing devices in a solvent or
steam bath, make sure that the temperature of the liquid is 50°C or below,
and that the circuit board is removed from the bath within one minute.
Ultrasonic cleaning should not be used with hermetically-sealed ceramic
packages such as a leadless chip carrier (LCC), pin grid array (PGA) or
charge-coupled device (CCD), because the bonding wires can become
disconnected due to resonance during the cleaning process. Even if a
device package allows ultrasonic cleaning, limit the duration of ultrasonic
cleaning to as short a time as possible, since long hours of ultrasonic
cleaning degrade the adhesion between the mold resin and the frame
material. The following ultrasonic cleaning conditions are recommended:
Frequency: 27 kHz to 29 kHz
Ultrasonic output power: 300 W or less (0.25 W/cm
2
or less)
Cleaning time: 30 seconds or less
Suspend the circuit board in the solvent bath during ultrasonic cleaning
in such a way that the ultrasonic vibrator does not come into direct
contact with the circuit board or the device.
(2)
(3)
(4)
(5)
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