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參數(shù)資料
| 型號： | TMP94C241CF |
| 廠商： | Toshiba Corporation |
| 元件分類： | 微控制器 |
| 英文描述： | Quality And Reliability Assurance / Handling Precautions |
| 中文描述： | 質(zhì)量與可靠性保證/操作注意事項 |
| 文件頁數(shù)： | 40/48頁 |
| 文件大?。?/td> | 390K |
| 代理商： | TMP94C241CF |
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Quality and Reliability Assurance / Handling Precautions
030901
QUA-40
2002-02-20
4.3.15 Other Precautions
(1)
When designing a system, be sure to incorporate fail-safe and other
appropriate measures according to the intended purpose of your system.
Also, be sure to debug your system under actual board-mounted
conditions.
If a plastic-package device is placed in a strong electric field, surface
leakage may occur due to the charge-up phenomenon, resulting in device
malfunction. In such cases, take appropriate measures to prevent this
problem, for example by protecting the package surface with a conductive
shield.
With some microcomputers and MOS memory devices, caution is required
when powering on or resetting the device. To ensure that your design does
not violate device specifications, consult the relevant databook for each
constituent device.
Ensure that no conductive material or object (such as a metal pin) can
drop onto and short the leads of a device mounted on a printed circuit
board.
(2)
(3)
(4)
4.4
Inspection, Testing and Evaluation
4.4.1 Grounding
Ground all measuring instruments, jigs, tools and soldering irons to
earth.
Electrical leakage may cause a device to break down or may result in
electric shock.
4.4.2 Inspection Sequence
x
Do not insert devices in the wrong orientation. Make sure that the
positive and negative electrodes of the power supply are correctly
connected. Otherwise, the rated maximum current or maximum
power dissipation may be exceeded and the device may break down
or undergo performance degradation, causing it to catch fire or
explode, resulting in injury to the user.
y
When conducting any kind of evaluation, inspection or testing using
AC power with a peak voltage of 42.4 V or DC power exceeding 60
V, be sure to connect the electrodes or probes of the testing
equipment to the device under test before powering it on.
Connecting the electrodes or probes of testing equipment to a device
while it is powered on may result in electric shock, causing injury.
(1)
Apply voltage to the test jig only after inserting the device securely into it.
When applying or removing power, observe relevant precautions, if any.
Make sure that the voltage applied to the device is off before removing the
device from the test jig. Otherwise, the device may undergo performance
degradation or be destroyed.
(2)
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相關(guān)代理商/技術(shù)參數(shù) |
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| TMP94C251AFG(Z) | 制造商:Toshiba America Electronic Components 功能描述:MCU 32-bit TLCS-900 CISC ROMLess 5V 144-Pin PQFP |
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