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參數資料
| 型號： | TMP93PW20AF |
| 廠商： | Toshiba Corporation |
| 英文描述： | Quality And Reliability Assurance / Handling Precautions |
| 中文描述： | 質量與可靠性保證/操作注意事項 |
| 文件頁數： | 8/48頁 |
| 文件大小： | 390K |
| 代理商： | TMP93PW20AF |
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Quality and Reliability Assurance / Handling Precautions
030901
QUA-8
2002-02-20
2.1.1 Precaution for Dry Pack
Figure 2.2 shows the tray type of the dry
pack form. Precaution for handling dry pack
products are as follows.
x
Do not toss or drop to avoid damaging the
devices and/or the moisture proof bag.
y
Desiccant in the form of granulated silica
gel includes blue indicator beads which
become transparent when moisture is
present, such as if the bag is torn or opened.
In this case, the devices must be high
temperature baked to remove the moisture
prior to solder mounting.
z
Store the pack at 30
°
C / 90%RH. After
opening the pack mount it the device within
12 months of the date on the seal. If the
30% humidity indicator is entirely pink
when the device unpacked, or when the 12-
month duration has expired treat the
device before use at high temperature (bake
it at more than 125
°
C for 20h) to remove
moisture.
{
How quickly a product should be used after
the pack is opened depends of the product.
See Tables 2-2 and 2-3 for details. If the
time limit for use has expired when devices
are unpacked, they should be baked.
|
Devices in heat-proof trays should be baked
at 125
°
C for at least 20h.
Heat-proof trays bear the mold marking
“HEAT PROOF” .
Be careful not to bend the leads when
baking devices.
}
Binding trays using a plastic tapes
If trays are rebound with plastic tapes after
having been untied, two tapes should be
used as shown in Figure 2.2 (a). If a tape is
tied lengthwise along the trays the tray
edges may break.
Figure 2.2 SMDs Dry pack Form
(a) Method
Heat-proof tray (occasionally non-heat-proof)
Moisture proof bag
(Aluminum laminate)
Heat proof tray
Corrugated
cardboard box
Heat seal
Turn under
Label
Plastic band
Indicator
Silica gel
IC
(b) Shipping carton
Sealing tape
Corrugated
cardboard box
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相關代理商/技術參數 |
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| TMP93PW20AFG | 功能描述:16位微控制器 - MCU OTP MCU RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數據總線寬度:16 bit 最大時鐘頻率:24 MHz 程序存儲器大小:8 KB 數據 RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風格:SMD/SMT |
| TMP93PW32 | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:CMOS 16-Bit Microcontroller |
| TMP93PW32F | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:Quality And Reliability Assurance / Handling Precautions |
| TMP93PW32F(Z) | 功能描述:16位微控制器 - MCU OTP MCU: TLCS-900/L RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數據總線寬度:16 bit 最大時鐘頻率:24 MHz 程序存儲器大小:8 KB 數據 RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風格:SMD/SMT |
| TMP93PW40 | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:CMOS 16-Bit Microcontroller |
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