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參數(shù)資料
| 型號(hào)： | TMP93CT76F |
| 廠商： | Toshiba Corporation |
| 英文描述： | Quality And Reliability Assurance / Handling Precautions |
| 中文描述： | 質(zhì)量與可靠性保證/操作注意事項(xiàng) |
| 文件頁數(shù)： | 18/48頁 |
| 文件大?。?/td> | 390K |
| 代理商： | TMP93CT76F |
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Quality and Reliability Assurance / Handling Precautions
030901
QUA-18
2002-02-20
(5) 870/X Series
Table 2.7 Storage conditions, permissible usage Period after unpacking and baking
requirements for each soldering method
Products
Name
TMP88CK48F
TMP88CM48F
TMP88CS48AF
TMP88CK49F
TMP88CM49F
TMP88PS49F
TMP88C060F
TMP88CU74F
TMP88PU74F
TMP88CP76F
TMP88CS76F
TMP88PS76F
TMP88CP77F
TMP88CS77F
TMP88PU77F
Note 1:
Package no.
Air reflow
Infrared reflow
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-LQFP80-1212-0.50A
P-QFP80-1420-0.80B
P-QFP80-1420-0.80B
P-QFP80-1420-0.80B
P-QFP80-1420-0.80B
P-QFP80-1420-0.80B
P-QFP100-1420-0.65A
P-QFP100-1420-0.65A
P-QFP100-1420-0.65A
As of March, 2001
Symbols A (168h), B (72h), C (48h), D (24h), E(12h),
G
and
indicate
the maximum permissible period between unpacking and mounting of
the device, and the required storage conditions for the device. For
details of these conditions, please refer to Table 2.2.
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
B(72h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
B(72h)
A(168h)
B(72h)
Note 2:
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TMP93CU44 | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:CMOS 16-Bit Microcontroller |
| TMP93CU44DF | 制造商:Toshiba America Electronic Components 功能描述:TLCS 900/L M/ ROM, 96K ROM, 3K RAM - Tape and Reel |
| TMP93CU76 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microcontroller |
| TMP93CU76F | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:Quality And Reliability Assurance / Handling Precautions |
| TMP93CW40 | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:CMOS 16-Bit Microcontrollers |
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