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參數(shù)資料
| 型號： | TMP93CS41DF |
| 廠商： | Toshiba Corporation |
| 英文描述： | Quality And Reliability Assurance / Handling Precautions |
| 中文描述： | 質(zhì)量與可靠性保證/操作注意事項 |
| 文件頁數(shù)： | 5/48頁 |
| 文件大小： | 390K |
| 代理商： | TMP93CS41DF |
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Quality and Reliability Assurance / Handling Precautions
030901
QUA-5
2002-02-20
2 Handling Precautions for Microcontrollers
2.1
Mounting Precautions
Plastics have basically porous feature. When a chip (especially an SMD which has a thin
plastic surface) is heated in a state of moisturized and is soldered by the reflow soldering
method, moisture is vaporized as the temperature rises to cause a package expanded. Or a
borderd surface between a lead frame and a plastic material is peeled off to cause a crack.
These bring serious troubles on reliability.
In order to prevent hygroscopity or enable high heat treatment after absorbing moisture,
Toshiba uses a dampproof packing and/or a heat proof tray.
(1)
Recommended Methods of Soldering for Flat Packages
Table 2.1 lists the recommended method of soldering flat packages. If you have
any question or request, please refer to “IC PACKAGE MANUAL” or contact
your local offices.
For overall heating method, recommended mounting methods and
conditions after opening the pack differ depending on products to be
used. See Table 2.2 and 2.3 for the details.
For locally heating a lead part, soldering iron method is
recommended. For other localized heating methods, refer to “IC
PACKAGE MANUAL” or contact your Toshiba local offices.
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| TMP96PM40F | Quality And Reliability Assurance / Handling Precautions |
| TMP96C031ZF | Quality And Reliability Assurance / Handling Precautions |
| TMP93CW40DF | Quality And Reliability Assurance / Handling Precautions |
| TMP93CW41DF | Lens Cap; Leaded Process Compatible:Yes RoHS Compliant: Yes |
| TMP93CW44DF | Quality And Reliability Assurance / Handling Precautions |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TMP93CS41DFG(JOA) | 制造商:Toshiba America Electronic Components 功能描述: |
| TMP93CS41F | 功能描述:16位微控制器 - MCU ROMLESS 2K RAM 900/L RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時鐘頻率:24 MHz 程序存儲器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT |
| TMP93CS42AF | 制造商:Toshiba America Electronic Components 功能描述:TLCS-900/L M/ROM, 64K ROM, 2K RAM - Tape and Reel |
| TMP93CS44 | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:CMOS 16-Bit Microcontroller |
| TMP93CS44DF | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:16-Bit Microcontroller |
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