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參數(shù)資料
| 型號： | TMP93CF77F |
| 廠商： | Toshiba Corporation |
| 英文描述： | Quality And Reliability Assurance / Handling Precautions |
| 中文描述： | 質(zhì)量與可靠性保證/操作注意事項 |
| 文件頁數(shù)： | 42/48頁 |
| 文件大?。?/td> | 390K |
| 代理商： | TMP93CF77F |
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Quality and Reliability Assurance / Handling Precautions
030901
QUA-42
2002-02-20
(3)
For the minimum clearance specification between
a device and a printed circuit board, refer to the
relevant device’s datasheet or databook. If
necessary, achieve the required clearance by
forming the device’s leads appropriately. Do not
use the spacers which are used to raise devices
above the surface of the printed circuit board during soldering to achieve
clearance. These spacers normally continue to expand due to heat, even
after the solder has begun to solidify; this applies severe stress to the
device.
Observe the following precautions when forming the leads of a device
prior to mounting so as to avoid mechanical stress to the device. Also
avoid ending or stretching device leads repeatedly.
(a)
Use a tool or jig to secure the lead at its base (where the lead meets
the device package) while bending so as to avoid mechanical stress
to the device. Also avoid bending or stretching device leads
repeatedly.
(4)
(b)
Be careful not to damage the lead during lead forming.
(c)
Follow any other precautions described in the individual datasheets
and databooks for each device and package type.
4.5.2 Socket Mounting
(1)
When socket mounting devices on a printed circuit board, use sockets
which match the inserted device’s package.
Use sockets whose contacts have the appropriate contact pressure. If the
contact pressure is insufficient, the socket may not make a perfect contact
when the device is repeatedly inserted and removed; if the pressure is
excessively high, the device leads may be bent or damaged when they are
inserted into or removed from the socket.
When soldering sockets to the printed circuit board, use sockets whose
construction prevents flux from penetrating into the contacts or which
allows flux to be completely cleaned off.
Make sure the coating agent applied to the printed circuit board for
moisture-proofing purposes does not stick to the socket contacts.
If the device leads are severely bent by a socket as it is inserted or
removed and you wish to repair the leads so as to continue using the
device, make sure that this lead correction is only performed once. Do not
use devices whose leads have been corrected more than once.
If the printed circuit board with the devices mounted on it will be
subjected to vibration from external sources, use sockets which have a
strong contact pressure so as to prevent the sockets and devices from
vibrating relative to one another.
(2)
(3)
(4)
(5)
(6)
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| TMP93CM41F | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:16-Bit Microcontroller |
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