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參數(shù)資料
| 型號： | TMP91PW10F |
| 廠商： | Toshiba Corporation |
| 英文描述： | Quality And Reliability Assurance / Handling Precautions |
| 中文描述： | 質(zhì)量與可靠性保證/操作注意事項 |
| 文件頁數(shù)： | 9/48頁 |
| 文件大?。?/td> | 390K |
| 代理商： | TMP91PW10F |
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Quality and Reliability Assurance / Handling Precautions
030901
QUA-9
2002-02-20
Table 2.2 Usable period after opening moisture proof bags
SYMBOL
A = 168h
Usable period after opening moisture proof bags
Products sealed in moisture proof packing should be stored in temperature below
30°C and relative humidity below 60%, and should be used within 168 hours (1 week),
after opened. If the products are kept beyond 168 hours (1 week) after opened, the
products should be baked for at least 20 hours at 125°C before mounted. After baked,
the products should be stored in temperature below 30°C and relative humidity below
60%, and should be used within 192 hours.
Products sealed in moisture proof packing should be stored in temperature below
30°C and relative humidity below 60%, and should be used within 72 hours (3 days),
after opened. If the products are kept beyond 72 hours (3days) after opened, the
products should be stored in temperature below 30°C and relative humidity below
60%, and should be used within 96 hours (4 days).
Products sealed in moisture proof packing should be stored in temperature below
30°C and relative humidity below 60%, and should be used within 48 hours (2 days),
after opened. If the products are kept beyond 48 hours (2 days) after opened, the
products should be baked for at least 20 hours at 125°C before mounted. After baked,
the products should be stored in temperature below 30°C and relative humidity below
60%, and should be used within 72 hours (3 days).
Products sealed in moisture proof packing should be stored in temperature below
30°C and relative humidity below 60%, and should be used within 24 hours (1 day),
after opened. If the products are kept beyond 24 hours (1 day) after opened, the
products should be baked for at least 20 hours at 125°C before mounted. After baked,
the products should be stored in temperature below 30°C and relative humidity below
60%, and should be used within 48 hours (2 days).
Products sealed in moisture proof packing should be stored in temperature below
30°C and relative humidity below 60%, and should be used within 12 hours, after
opened. If the products are kept beyond 12 hours after opened, the products should
be baked for at least 20 hours at 125°C before mounted. After baked, the products
should be stored in temperature below 30°C and relative humidity below 60%, and
should be used within 36 hours.
For the details, contact your Toshiba local offices.
Overall heating method is not recommended for mounting ; use soldering iron method
of localized heating method.
B = 72h
C = 48h
D = 24h
E = 12h
G
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相關(guān)代理商/技術(shù)參數(shù) |
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| TMP91PW10FG(JZ) | 功能描述:16位微控制器 - MCU OTP MCU: TLCS-900/L1 RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時鐘頻率:24 MHz 程序存儲器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT |
| TMP91PW11F | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:Quality And Reliability Assurance / Handling Precautions |
| TMP91PW11FG | 功能描述:16位微控制器 - MCU OTP MCU: TLCS-900/L1 RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時鐘頻率:24 MHz 程序存儲器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT |
| TMP91PW12F | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:Quality And Reliability Assurance / Handling Precautions |
| TMP91PW18AF | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:Quality And Reliability Assurance / Handling Precautions |
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