參數(shù)資料
型號： TMP91FY22F
廠商： Toshiba Corporation
元件分類： 微控制器
英文描述： Quality And Reliability Assurance / Handling Precautions
中文描述： 質(zhì)量與可靠性保證/操作注意事項
文件頁數(shù)： 40/48頁
文件大?。?/td> 390K
代理商： TMP91FY22F
Quality and Reliability Assurance / Handling Precautions
030901
QUA-40
2002-02-20
4.3.15 Other Precautions
(1)
When designing a system, be sure to incorporate fail-safe and other
appropriate measures according to the intended purpose of your system.
Also, be sure to debug your system under actual board-mounted
conditions.
If a plastic-package device is placed in a strong electric field, surface
leakage may occur due to the charge-up phenomenon, resulting in device
malfunction. In such cases, take appropriate measures to prevent this
problem, for example by protecting the package surface with a conductive
shield.
With some microcomputers and MOS memory devices, caution is required
when powering on or resetting the device. To ensure that your design does
not violate device specifications, consult the relevant databook for each
constituent device.
Ensure that no conductive material or object (such as a metal pin) can
drop onto and short the leads of a device mounted on a printed circuit
board.
(2)
(3)
(4)
4.4
Inspection, Testing and Evaluation
4.4.1 Grounding
Ground all measuring instruments, jigs, tools and soldering irons to
earth.
Electrical leakage may cause a device to break down or may result in
electric shock.
4.4.2 Inspection Sequence
x
Do not insert devices in the wrong orientation. Make sure that the
positive and negative electrodes of the power supply are correctly
connected. Otherwise, the rated maximum current or maximum
power dissipation may be exceeded and the device may break down
or undergo performance degradation, causing it to catch fire or
explode, resulting in injury to the user.
y
When conducting any kind of evaluation, inspection or testing using
AC power with a peak voltage of 42.4 V or DC power exceeding 60
V, be sure to connect the electrodes or probes of the testing
equipment to the device under test before powering it on.
Connecting the electrodes or probes of testing equipment to a device
while it is powered on may result in electric shock, causing injury.
(1)
Apply voltage to the test jig only after inserting the device securely into it.
When applying or removing power, observe relevant precautions, if any.
Make sure that the voltage applied to the device is off before removing the
device from the test jig. Otherwise, the device may undergo performance
degradation or be destroyed.
(2)
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TMP91FY22FG 功能描述:IC MCU FLASH 16BIT 256K 100QFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:TLCS-900/L1 標準包裝:330 系列:- 核心處理器:- 芯體尺寸:8/16-位 速度:40MHz 連通性:UART/USART 外圍設(shè)備:DMA，PWM，WDT 輸入/輸出數(shù):32 程序存儲器容量:- 程序存儲器類型:外部程序存儲器 EEPROM 大小:- RAM 容量:- 電壓 - 電源 (Vcc/Vdd):4.5 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:- 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:100-BQFP 包裝:管件
TMP91FY28 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:Original CMOS 16-Bit Microcontroller
TMP91FY42FG 制造商:Toshiba America Electronic Components 功能描述:IC 16BIT MCU 256K FLASH 120K RAM
TMP91FY42FG(C,JZ) 制造商:Toshiba America Electronic Components 功能描述:MCU 16BIT 256KB FLASH 100-LQFP
TMP91FY42FG(JZ) 功能描述:16位微控制器 - MCU TLCS900/L1 256K Flash RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時鐘頻率:24 MHz 程序存儲器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
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