參數(shù)資料
型號： TMP03FS-REEL
廠商： Analog Devices Inc
文件頁數(shù)： 5/16頁
文件大小： 214K
描述： IC SENSOR TEMP/SERIAL OC 8SOIC
產(chǎn)品變化通告： Product Discontinuance 27/Oct/2011
標準包裝： 2,500
功能： 溫度監(jiān)控系統(tǒng)（傳感器）
傳感器類型： 內(nèi)部
感應溫度： -40°C ~ 100°C
精確度： ±4°C（最小值）
拓撲： ADC（三角積分型），數(shù)字調(diào)制器
輸出類型： 開路集電極
輸出警報： 無
輸出風扇： 無
電源電壓： 4.5 V ~ 7 V
工作溫度： -55°C ~ 150°C
安裝類型： 表面貼裝
封裝/外殼： 8-SOIC（0.154"，3.90mm 寬）
供應商設(shè)備封裝： 8-SO
包裝： 帶卷 (TR)
TMP03/TMP04
REV. A
5
Table I. Counter Size and Clock Frequency Effects on Quantization Error
Maximum
Maximum
Maximum    Quantization    Quantization
Count Available   Temp Required   Frequency    Error (25C)
Error (77F)
4096
125癈
94 kHz
0.284癈
0.512癋
8192
125癈
188 kHz
0.142癈
0.256癋
16384
125癈
376 kHz
0.071癈
0.128癋
Optimizing Counter Characteristics
Counter resolution, clock rate, and the resultant temperature
decode error that occurs using a counter scheme may be deter-
mined from the following calculations:
1. T1 is nominally 10 ms, and compared to T2 is relatively
insensitive to temperature changes. A useful worst-case
assumption is that T1 will never exceed 12 ms over the
specified temperature range.
T1 max = 12 ms
Substituting this value for T1 in the formula, temperature
(癈) = 235  ([T1/T2] ?400), yields a maximum value of
T2 of 44 ms at 125癈. Rearranging the formula allows the
maximum value of T2 to be calculated at any maximum
operating temperature:
T2 (Temp) = (T1max ?400)/(235  Temp) in seconds
2. We now need to calculate the maximum clock frequency we
can apply to the gated counter so it will not overflow during
T2 time measurement. The maximum frequency is calculated
using:
Frequency (max) = Counter Size/ (T2 at maximum
temperature)
Substituting in the equation using a 12-bit counter gives,
Fmax = 4096/44 ms 94 kHz.
3. Now we can calculate the temperature resolution, or quanti-
zation error, provided by the counter at the chosen clock
frequency and temperature of interest. Again, using a 12-bit
counter being clocked at 90 kHz (to allow for ~5% tempera-
ture over-range), the temperature resolution at 25癈 is
calculated from:
Quantization Error (?/SPAN>C) = 400 ?/SPAN> ([Count1/Count2] 
[Count1  1]/[Count2 + 1])
Quantization Error (?/SPAN>F) = 720 ?/SPAN> ([Count1/Count2] 
[Count1  1]/[Count2 + 1])
where, Count1 = T1max ?Frequency, and Count2 =
T2 (Temp) ?Frequency. At 25癈 this gives a resolution of
better than 0.3癈. Note that the temperature resolution
calculated from these equations improves as temperature
increases. Higher temperature resolution will be obtained by
employing larger counters as shown in Table I. The internal
quantization error of the TMP03 sets a theoretical minimum
resolution of approximately 0.1癈 at 25癈.
Self-Heating Effects
The temperature measurement accuracy of the TMP03 may be
degraded in some applications due to self-heating. Errors intro-
duced are from the quiescent dissipation, and power dissipated
by the digital output. The magnitude of these temperature er-
rors is dependent on the thermal conductivity of the TMP03
package, the mounting technique, and effects of airflow. Static
dissipation in the TMP03 is typically 4.5mW operating at 5 V
with no load. In the TO-92 package mounted in free air, this
accounts for a temperature increase due to self-heating of
T = P
DISS
 ??/DIV>
JA
 = 4.5 mW ?162?SPAN class="pst TMP03FS-REEL_2285105_6">C/W = 0.73?SPAN class="pst TMP03FS-REEL_2285105_6">C (1.3?SPAN class="pst TMP03FS-REEL_2285105_6">F)
For a free-standing surface-mount TSSOP package, the tem-
perature increase due to self-heating would be
T = P
DISS
 ??/DIV>
JA
 = 4.5 mW ?240?SPAN class="pst TMP03FS-REEL_2285105_6">C/W = 1.08?SPAN class="pst TMP03FS-REEL_2285105_6">C (1.9?SPAN class="pst TMP03FS-REEL_2285105_6">F)
In addition, power is dissipated by the digital output which is
capable of sinking 800 礎(chǔ) continuous (TMP04). Under full
load, the output may dissipate
 
 
P
DISS
= 0.6V
(
)
0.8 mA
(
)
T2
T1+T2
?/DIV>
?/DIV>
?/DIV>
?/DIV>
?/DIV>
?/DIV>
For example, with T2 = 20 ms and T1 = 10 ms, the power
dissipation due to the digital output is approximately 0.32mW
with a 0.8 mA load. In a free-standing TSSOP package, this
accounts for a temperature increase due to output self-heating
of
T = P
DISS
 ??/DIV>
JA
 = 0.32 mW ?240?SPAN class="pst TMP03FS-REEL_2285105_6">C/W = 0.08?SPAN class="pst TMP03FS-REEL_2285105_6">C (0.14?SPAN class="pst TMP03FS-REEL_2285105_6">F)
This temperature increase adds directly to that from the quies-
cent dissipation and affects the accuracy of the TMP03 relative
to the true ambient temperature. Alternatively, when the same
package has been bonded to a large plate or other thermal mass
(effectively a large heatsink) to measure its temperature, the
total self-heating error would be reduced to approximately
T = P
DISS
 ??/DIV>
JC
 = (4.5 mW + 0.32 mW) ?43?SPAN class="pst TMP03FS-REEL_2285105_6">C/W = 0.21?SPAN class="pst TMP03FS-REEL_2285105_6">C (0.37?SPAN class="pst TMP03FS-REEL_2285105_6">F)
Calibration
The TMP03 and TMP04 are laser-trimmed for accuracy and
linearity during manufacture and, in most cases, no further
adjustments are required. However, some improvement in per-
formance can be gained by additional system calibration. To
perform a single-point calibration at room temperature, measure
the TMP03 output, record the actual measurement tempera-
ture, and modify the offset constant (normally 235; see the
Output Encoding section) as follows:
Offset Constant = 235 + (T
OBSERVED
  T
TMP03OUTPUT
)
A more complicated 2-point calibration is also possible. This
involves measuring the TMP03 output at two temperatures,
Temp1 and Temp2, and modifying the slope constant (normally
400) as follows:
 
 
Slope Constant =
Temp2 Temp1
T1@ Temp1
T2 @ Temp1
?/DIV>
?/DIV>
?/DIV>
?/DIV>
?/DIV>
?/DIV>

T1@ Temp2
T2 @ Temp2
?/DIV>
?/DIV>
?/DIV>
?/DIV>
?/DIV>
?/DIV>
where T1 and T2 are the output high and output low times,
respectively.
相關(guān)PDF資料
PDF描述
TMP141AIDBVTG4 IC TEMP SENSOR DGTL OUT SOT23-6
TMP401AIDGKTG4 IC TEMP SENSOR DGTL OUT 8-MSOP
TPS2346PWRG4 IC HOT SWAP POWER MGR 24-TSSOP
TPS24711DGSR IC CTRLR HOT SWAP 2.5-18V 10MSOP
TPS2491DGSG4 IC POS HV HOT-SWAP CTRLR 10-MSOP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TMP03FSZ 功能描述:IC SENSOR TEMP/SERIAL OC 8SOIC RoHS:是 類別:集成電路 (IC) >> PMIC - 熱管理 系列:- 標準包裝:2,500 系列:SilentSense™ 功能:溫度監(jiān)控系統(tǒng)（傳感器） 傳感器類型:內(nèi)部和外部 感應溫度:-55°C ~ 125°C，外部傳感器 精確度:±2°C 本地（最大），±3°C 遠程（最大） 拓撲:ADC（三角積分型），比較器，寄存器庫 輸出類型:I²C?/SMBus? 輸出警報:是 輸出風扇:是 電源電壓:2.7 V ~ 5.5 V 工作溫度:-55°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:8-TSSOP，8-MSOP（0.118"，3.00mm 寬） 供應商設(shè)備封裝:8-MSOP 包裝:帶卷 (TR) 其它名稱:MIC284-2BMMTRMIC284-2BMMTR-ND
TMP03FSZ-REEL 功能描述:IC SENSOR TEMP/SERIAL OC 8SOIC RoHS:是 類別:集成電路 (IC) >> PMIC - 熱管理 系列:- 標準包裝:2,500 系列:SilentSense™ 功能:溫度監(jiān)控系統(tǒng)（傳感器） 傳感器類型:內(nèi)部和外部 感應溫度:-55°C ~ 125°C，外部傳感器 精確度:±2°C 本地（最大），±3°C 遠程（最大） 拓撲:ADC（三角積分型），比較器，寄存器庫 輸出類型:I²C?/SMBus? 輸出警報:是 輸出風扇:是 電源電壓:2.7 V ~ 5.5 V 工作溫度:-55°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:8-TSSOP，8-MSOP（0.118"，3.00mm 寬） 供應商設(shè)備封裝:8-MSOP 包裝:帶卷 (TR) 其它名稱:MIC284-2BMMTRMIC284-2BMMTR-ND
TMP03FT9 功能描述:IC SENSOR TEMP/SERIAL OC TO-92-3 RoHS:否 類別:集成電路 (IC) >> PMIC - 熱管理 系列:- 標準包裝:2,500 系列:SilentSense™ 功能:溫度監(jiān)控系統(tǒng)（傳感器） 傳感器類型:內(nèi)部和外部 感應溫度:-55°C ~ 125°C，外部傳感器 精確度:±2°C 本地（最大），±3°C 遠程（最大） 拓撲:ADC（三角積分型），比較器，寄存器庫 輸出類型:I²C?/SMBus? 輸出警報:是 輸出風扇:是 電源電壓:2.7 V ~ 5.5 V 工作溫度:-55°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:8-TSSOP，8-MSOP（0.118"，3.00mm 寬） 供應商設(shè)備封裝:8-MSOP 包裝:帶卷 (TR) 其它名稱:MIC284-2BMMTRMIC284-2BMMTR-ND
TMP03FT9Z 功能描述:IC SENSOR TEMP/SERIAL OC TO-92-3 RoHS:是 類別:集成電路 (IC) >> PMIC - 熱管理 系列:- 標準包裝:2,500 系列:SilentSense™ 功能:溫度監(jiān)控系統(tǒng)（傳感器） 傳感器類型:內(nèi)部和外部 感應溫度:-55°C ~ 125°C，外部傳感器 精確度:±2°C 本地（最大），±3°C 遠程（最大） 拓撲:ADC（三角積分型），比較器，寄存器庫 輸出類型:I²C?/SMBus? 輸出警報:是 輸出風扇:是 電源電壓:2.7 V ~ 5.5 V 工作溫度:-55°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:8-TSSOP，8-MSOP（0.118"，3.00mm 寬） 供應商設(shè)備封裝:8-MSOP 包裝:帶卷 (TR) 其它名稱:MIC284-2BMMTRMIC284-2BMMTR-ND
TMP03GBC 制造商:AD 制造商全稱:Analog Devices 功能描述:Serial Digital Output Thermometers
發(fā)布緊急采購，3分鐘左右您將得到回復。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*