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參數(shù)資料
| 型號： | TLV803ZDBZR |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 電源管理 |
| 英文描述： | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO3 |
| 封裝： | PLASTIC, SOT-23, 3 PIN |
| 文件頁數(shù)： | 6/13頁 |
| 文件大小： | 381K |
| 代理商： | TLV803ZDBZR |
SBVS157A
– APRIL 2011 – REVISED JUNE 2011
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION(1)
SPECIFIED
THRESHOLD
PACKAGE-
PACKAGE
OPERATING
PACKAGE
ORDERING
TRANSPORT MEDIA,
PRODUCT
VOLTAGE
LEAD
DESIGNATOR
TEMPERATURE
MARKING
INFORMATION
QUANTITY
TLV803ZDBZR
Tape and Reel, 3000
TLV803Z
2.25 V
SOT23-3
DBZ
–40°C TO +125°C
VORQ
TLV803ZDBZT
Tape and Reel, 250
TLV803RDBZR
Tape and Reel, 3000
TLV803R
2.64 V
SOT23-3
DBZ
–40°C TO +125°C
VOSQ
TLV803RDBZT
Tape and Reel, 250
TLV803SDBZR
Tape and Reel, 3000
TLV803S
2.93 V
SOT23-3
DBZ
–40°C TO +125°C
VOTQ
TLV803SDBZT
Tape and Reel, 250
TLV803MDBZR
Tape and Reel, 3000
TLV803M
4.38 V
SOT23-3
DBZ
–40°C TO +125°C
VOUQ
TLV803MDBZT
Tape and Reel, 250
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range (unless otherwise noted) .
VALUE
MIN
MAX
UNIT
VDD
(2)
0
7
V
Voltage
All other pins(2)
–0.3
7
V
Maximum low output current, IOL
5
mA
Maximum high output current, IOH
–5
mA
Current
Input clamp current, IIK (VI < 0 or VI > VDD)
±20
mA
Output clamp current, IOK (VO < 0 or VO > VDD)
±20
mA
Operating free-air temperature range, TA
–40
+125
°C
Temperature
Storage temperature range, Tstg
–65
+150
°C
Soldering temperature
+260
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to GND. For reliable operation the device should not be operated at 7 V for more than t = 1000h
continuously
THERMAL INFORMATION
TLV803
THERMAL METRIC(1)
DBZ
UNITS
3 PINS
θJA
Junction-to-ambient thermal resistance
286.9
θJCtop
Junction-to-case (top) thermal resistance
105.6
θJB
Junction-to-board thermal resistance
124.4
°C/W
ψJT
Junction-to-top characterization parameter
25.8
ψJB
Junction-to-board characterization parameter
107.9
θJCbot
Junction-to-case (bottom) thermal resistance
—
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
Copyright
2011, Texas Instruments Incorporated
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