參數(shù)資料
型號: TLV341AIDCKRG4
廠商: Texas Instruments
文件頁數(shù): 23/36頁
文件大小: 0K
描述: IC OPAMP GP R-R 2.3MHZ SC70-6
標(biāo)準(zhǔn)包裝: 3,000
放大器類型: 通用
電路數(shù): 1
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 1 V/µs
增益帶寬積: 2.3MHz
電流 - 輸入偏壓: 1pA
電壓 - 輸入偏移: 300µV
電流 - 電源: 75µA
電流 - 輸出 / 通道: 115mA
電壓 - 電源,單路/雙路(±): 1.5 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 6-TSSOP,SC-88,SOT-363
供應(yīng)商設(shè)備封裝: SC-70-6
包裝: 帶卷 (TR)
TLV341, TLV342, TLV342S, TLV344
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT CMOS OPERATIONAL AMPLIFIERS
WITH SHUTDOWN
SLVS568C JANUARY 2005 REVISED NOVEMBER 2007
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
ORDERING INFORMATION
TA
MAX VIO
(25
5C)
PACKAGE
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING§
SOT 23
DBV
Reel of 3000
TLV341IDBVR
YC9
SOT-23 – DBV
Reel of 250
TLV341IDBVT
YC9_
Single
SC 70
DCK
Reel of 3000
TLV341IDCKR
Y4
Single
SC-70 – DCK
Reel of 250
TLV341IDCKT
Y4_
SOT-563 – DRL
Reel of 4000
TLV341IDRLR
Y4_
QFN
RUG
Reel of 3000
TLV342IRUGR
Y6E
St
d d
QFN – RUG
Reel of 3000
TLV342SIRUGR
2YE
Standard
grade: 4 mV
Dual
SOIC
D
Tube of 75
TLV342ID
TY342
grade: 4 mV
Dual
SOIC – D
Reel of 2500
TLV342IDR
TY342
MSOP/VSSOP
DGK
Reel of 2500
TLV342IDGKR
PREVIEW
MSOP/VSSOP – DGK
Reel of 250
TLV342IDGKT
PREVIEW
SOIC
D
Tube of 50
TLV344ID
PREVIEW
Quad
SOIC – D
Reel of 2500
TLV344IDR
PREVIEW
40
°C to 125°C
Quad
TSSOP
PW
Tube of 90
TLV344IPWR
PREVIEW
40 C to 125 C
TSSOP – PW
Reel of 2000
TLV344IPWR
PREVIEW
SOT 23
DBV
Reel of 3000
TLV341AIDBVR
YCG
Single
SOT-23 – DBV
Reel of 250
TLV341AIDBVT
YCG_
Single
SC 70
DCK
Reel of 3000
TLV341AIDCKR
Y5
SC-70 – DCK
Reel of 250
TLV341AIDCKT
Y5_
SOIC
D
Tube of 75
TLV342AID
TY342A
A grade:
Dual
SOIC – D
Reel of 2500
TLV342AIDR
TY342A
A grade:
1.25 mV
Dual
MSOP/VSSOP
DGK
Reel of 2500
TLV342AIDGKR
PREVIEW
MSOP/VSSOP – DGK
Reel of 250
TLV342AIDGKT
PREVIEW
SOIC
D
Tube of 50
TLV344AID
PREVIEW
Quad
SOIC – D
Reel of 2500
TLV344AIDR
PREVIEW
Quad
TSSOP
PW
Tube of 90
TLV344AIPWR
PREVIEW
TSSOP – PW
Reel of 2000
TLV344AIPWR
PREVIEW
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
§ DBV/DCK/DRL: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
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