參數(shù)資料
型號(hào)： TLV2721Y
廠商： Texas Instruments, Inc.
英文描述： Advanced LinCMOSE RAIL-TO-RAIL VERY LOW-POWER SINGLE OPERATIONAL AMPLIFIERS
中文描述： 高級(jí)LinCMOSE軌至軌極低功耗的單運(yùn)算放大器
文件頁(yè)數(shù)： 1/28頁(yè)
文件大?。?/td> 579K
代理商： TLV2721Y
TLV2721, TLV2721Y
Advanced LinCMOS
RAIL-TO-RAIL
VERY LOW-POWER SINGLE OPERATIONAL AMPLIFIERS
SLOS197 – AUGUST1997
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
Output Swing Includes Both Supply Rails
Low Noise . . . 19 nV/
√
Hz Typ at f = 1 kHz
Low Input Bias Current . . . 1 pA Typ
Fully Specified for Single-Supply 3-V and
5-V Operation
Very Low Power . . . 110
μ
A Typ
Common-Mode Input Voltage Range
Includes Negative Rail
Wide Supply Voltage Range
2.7 V to 10 V
Macromodel Included
description
The TLV2721 is a single low-voltage operational amplifier available in the SOT-23 package. It offers a
compromise between the ac performance and output drive of the TLV2731 and the micropower TLV2711.
It consumes only 150
μ
A (max) of supply current and is ideal for battery-powered applications. The device
exhibits rail-to-rail output performance for increased dynamic range in single- or split-supply applications. The
TLV2721 is fully characterized at 3 V and 5 V and is optimized for low-voltage applications.
The TLV2721, exhibiting high input impedance and low noise, is excellent for small-signal conditioning for
high-impedance sources, such as piezoelectric transducers. Because of the micropower dissipation levels
combined with 3-V operation, these devices work well in hand-held monitoring and remote-sensing
applications. In addition, the rail-to-rail output feature with single or split supplies makes this family a great
choice when interfacing with analog-to-digital converters (ADCs).
With a total area of 5.6mm
2
, the SOT-23 package only requires one third the board space of the standard 8-pin
SOIC package. This ultra-small package allows designers to place single amplifiers very close to the signal
source, minimizing noise pick-up from long PCB traces.
AVAILABLE OPTIONS
TA
VIOmax AT 25
°
C
PACKAGED DEVICES
SYMBOL
CHIP
FORM
(Y)
SOT-23 (DBV)
0
°
C to 70
°
C
–40
°
C to 85
°
C
The DBV package available in tape and reel only.
Chip forms are tested at TA = 25
°
C only.
3 mV
3 mV
TLV2721CDBV
TLV2721IDBV
VAKC
VAKI
TLV2721Y
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
DBV PACKAGE
(TOP VIEW)
5
4
3
1
2
IN+
VDD+
OUT
VDD– /GND
IN–
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright
1997, Texas Instruments Incorporated
Advanced LinCMOS is a trademark of Texas Instruments Incorporated.
相關(guān)PDF資料
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TLV272CDG4 功能描述:運(yùn)算放大器 - 運(yùn)放 550-uA/Ch 3-MHz Rail-to-Rail Out RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
TLV272CDGK 功能描述:運(yùn)算放大器 - 運(yùn)放 550-uA/Ch 3-MHz Rail-to-Rail Out RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
TLV272CDGKG4 功能描述:運(yùn)算放大器 - 運(yùn)放 550-uA/Ch 3-MHz Rail-to-Rail Out RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
TLV272CDGKR 功能描述:運(yùn)算放大器 - 運(yùn)放 550-uA/Ch 3-MHz Rail-to-Rail Out RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
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