參數(shù)資料
型號: TLV2354MFK
廠商: Texas Instruments, Inc.
英文描述: LinCMOSE QUADRUPLE LOW-VOLTAGE DIFFERENTIAL COMPARATORS
中文描述: LinCMOSE翻兩番低壓差分比較器
文件頁數(shù): 4/20頁
文件大?。?/td> 300K
代理商: TLV2354MFK
TLV2354, TLV2354Y
LinCMOS
QUADRUPLE LOW-VOLTAGE DIFFERENTIAL COMPARATORS
SLCS012B – MAY 1992 – REVISED MARCH 1999
4
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TLV2354Y chip information
This chip, when properly assembled, displays characteristics similar to the TLV2354. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip may be mounted with
conductive epoxy or a gold-silicon preform.
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4
×
4 MILS MINIMUM
TJmax = 150
°
C
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
PIN (11) INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
+
OUT
IN+
IN–
VDD
GND
(10)
(7)
(6)
(11)
(1)
+
(13)
IN+
IN–
OUT
(12)
(4)
(5)
+
(2)
+
(9)
(8)
(14)
OUT
IN+
IN–
OUT
IN+
IN–
(3)
BONDING PAD ASSIGNMENTS
65
90
(13)
(1)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(12)
(14)
(2)
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