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參數(shù)資料
| 型號(hào)： | TLV226X |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | Rail-To-Rail Low-Voltage Low-Power Operational Amplifier Family |
| 中文描述： | 軌至軌低電壓低功耗運(yùn)算放大器系列 |
| 文件頁(yè)數(shù)： | 2/51頁(yè) |
| 文件大?。?/td> | 817K |
| 代理商： | TLV226X |
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TLV226x, TLV226xA
Advanced LinCMOS
RAIL-TO-RAIL
OPERATIONAL AMPLIFIERS
SLOS186A – FEBRUARY 1997 – REVISED JULY 1999
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TLV2262 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25
°
C
SMALL
OUTLINE
(D)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(JG)
PLASTIC
DIP
(P)
TSSOP
(PW)
CERAMIC
FLATPACK
(U)
0
°
C to 70
°
C
2.5 mV
TLV2262CD
—
—
TLV2262CP
TLV2262CPWLE
—
–40
°
C to 85
°
C
950
V
2.5 mV
TLV2262AID
TLV2262ID
—
—
—
—
TLV2262AIP
TLV2262IP
TLV2262AIPWLE
—
—
—
μ
–40
°
C to 125
°
C
950
V
2.5 mV
950
μ
V
2.5 mV
TLV2262AQD
TLV2262QD
—
—
—
—
—
—
—
—
—
—
μ
–55
°
C to 125
°
C
—
—
TLV2262AMFK
TLV2262MFK
TLV2262AMJG
TLV2262MJG
—
—
—
—
TLV2262AMU
TLV2262MU
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2262CDR).
The PW package is available only left-end taped and reeled.
§Chips are tested at 25
°
C.
TLV2264 AVAILABLE OPTIONS
PACKAGED DEVICES
CERAMIC
DIP
(J)
TA
VIOmax
AT 25
°
C
SMALL
OUTLINE
(D)
CHIP
CARRIER
(FK)
PLASTIC
DIP
(N)
TSSOP
(PW)
CERAMIC
FLATPACK
(W)
–40
°
C to
85
°
C
950
V
2.5 mV
TLV2264AID
TLV2264ID
—
—
—
—
TLV2264AIN
TLV2264IN
TLV2264AIPWLE
—
—
—
μ
–40
°
C to
125
°
C
–55
°
C to
125
°
C
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2262IDR).
The PW package is available only left-end taped and reeled.
§Chips are tested at 25
°
C.
950
V
2.5 mV
950
μ
V
2.5 mV
TLV2264AQD
TLV2264QD
—
—
—
—
—
—
—
—
—
—
μ
—
—
TLV2264AMFK
TLV2264MFK
TLV2264AMJ
TLV2264MJ
—
—
—
—
TLV2264AMW
TLV2264MW
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TLV226xA | Advanced LinCMOS(TM) Rail-To-Rail Operational Amplifier Family |
| TLV226XA | Advanced LinCMOS RAIL-TO-RAIL OPERATIONAL AMPLIFIERS |
| TLV2262MFK | Advanced LinCMOSE RAIL-TO-RAIL OPERATIONAL AMPLIFIERS |
| TLV2262MJG | FITTING FOR TYPE LDP SURFACE RACEWAY, INSIDE CORNER, USE WITH LDP3 RoHS Compliant: Yes |
| TLV2262MU | Advanced LinCMOSE RAIL-TO-RAIL OPERATIONAL AMPLIFIERS |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TLV226X_06 | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:ADVANCED LINCOMS RAIL-TO-RAIL OPERATIONAL AMPLIFIERS |
| TLV226X_07 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:Advanced LinCMOS RAIL-TO-RAIL OPERATIONAL AMPLIFIERS |
| TLV226X_08 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:Advanced LinCMOS RAIL-TO-RAIL OPERATIONAL AMPLIFIERS |
| TLV226XA | 制造商:TI 制造商全稱:Texas Instruments 功能描述:Advanced LinCMOS RAIL-TO-RAIL OPERATIONAL AMPLIFIERS |
| TLV227X | 制造商:TI 制造商全稱:Texas Instruments 功能描述:FAMILY OF 2.7-V HIGH-SLEW-RATE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN |
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