參數(shù)資料
型號(hào): TLK2201AIRCP
廠商: Texas Instruments, Inc.
英文描述: ETHERNET TRANSCEIVERS
中文描述: 以太網(wǎng)收發(fā)器
文件頁(yè)數(shù): 10/21頁(yè)
文件大?。?/td> 343K
代理商: TLK2201AIRCP
TLK2201A, TLK2201AI
ETHERNET TRANSCEIVERS
SLLS572
JUNE 2003
10
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
Terminal Functions (Continued)
TERMINAL
I/O
DESCRIPTION
NAME
NO.
GROUND
GNDA
51,58
Ground
Analog ground. GNDA provides a ground for the high-speed analog circuits, RX and TX.
GND
1, 14, 21,
25, 33, 46
Ground
Digital logic ground. Provides a ground for the logic circuits and digital I/O buffers.
GNDPLL
64
Ground
PLL ground. Provides a ground for the PLL circuitry.
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Supply voltage, V
DD
(see Note 1)
Input voltage range at TTL terminals, V
I
Input voltage range at any other terminal
Storage temperature, T
stg
Electrostatic discharge
Characterized free-air operating temperature range
Characterized free-air operating temperature range: TLK2201A
0.3 V to 3 V
0.5 V to 4 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
0.3 V to V
DD
+0.3 V
65
°
C to 150
°
C
CDM: 1 kV, HBM:2 kV
0
°
C to 70
°
C
0
°
C to 70
°
C
40
°
C to 85
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . .
TLK2201AI
Stresses beyond those listed under
absolute maximum ratings
may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under
recommended operating conditions
is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
DISSIPATION RATING TABLE
OPERATING FACTOR
ABOVE TA = 25
°
C
5.25 W
46.58 mW/
°
C
3.17 W
23.70 mW/
°
C
2.01 W
13.19 mW/
°
C
PACKAGE
TA
25
°
C
POWER RATING
TA = 70
°
C
POWER RATING
RCP64
§
RCP64
RCP64#
2.89 W
1.74 W
1.11 W
This is the inverse of the traditional junction-to-ambient thermal resistance (R
θ
JA).
§
2 oz. Trace and copper pad with solder.
2 oz. Trace and copper pad without solder.
#Standard JEDEC high-K board
NOTE: For more information, refer to TI application note
PowerPAD Thermally Enhanced
Package,
TI literature number SLMA002.
thermal characteristics
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
Board-mounted, no air flow, high conductivity TI
recommended test board, chip soldered or greased to
thermal land
Board-mounted, no air flow, high conductivity TI
recommended test board with thermal land but no
solder or grease thermal connection to thermal land
Board-mounted, no air flow, JEDEC test board
Board-mounted, no air flow, high conductivity TI
recommended test board, chip soldered or greased to
thermal land
Board-mounted, no air flow, high conductivity TI
recommended test board with thermal land but no
solder or grease thermal connection to thermal land
Board-mounted, no air flow, JEDEC test board
21.47
R
θ
JA
Junction-to-free-air thermal resistance
42.20
°
C/W
75.83
0.38
R
θ
JC
Junction-to-case-thermal resistance
0.38
°
C/W
7.8
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