參數(shù)資料
型號: TLGE53T
廠商: Toshiba Corporation
英文描述: TOSHIBA InGaALP LED
中文描述: 東芝超高亮度四元素發(fā)光二極管
文件頁數(shù): 2/12頁
文件大?。?/td> 221K
代理商: TLGE53T
TL(RE,RME,SE,OE,YE,PYE,GE,FGE,PGE)53T
2002-01-17
2
Maximum Ratings
(Ta 25°C)
Product Name
Forward Current
I
F
(mA)
Reverse Voltage
V
R
(V)
Power Dissipation
P
D
(mW)
Operating
Temperature
T
opr
(°C)
Storage
Temperature
T
stg
(°C)
TLRE53T
50
4
120
TLRME53T
50
4
120
TLSE53T
50
4
120
TLOE53T
50
4
120
TLYE53T
50
4
120
TLPYE53T
50
4
120
TLGE53T
50
4
120
TLFGE53T
50
4
120
TLPGE53T
50
4
120
40~100
40~120
Electrical and Optical Characteristics
(Ta 25°C)
Typ. Emission Wavelength
Luminous Intensity
I
V
Min
Typ.
Forward Voltage
V
F
Typ.
Max
Reverse Current
I
R
Max
Product Name
d
P
I
F
I
F
I
F
V
R
TLRE53T
630
(644)
20
20
153
400
20
1.9
2.4
20
50
4
TLRME53T
626
(636)
23
20
272
600
20
1.9
2.4
20
50
4
TLSE53T
613
(623)
20
20
272
800
20
1.9
2.4
20
50
4
TLOE53T
605
(612)
20
20
272
1000
20
2.0
2.4
20
50
4
TLYE53T
587
(590)
17
20
272
800
20
2.0
2.4
20
50
4
TLPYE53T
580
(583)
14
20
153
450
20
2.0
2.4
20
50
4
TLGE53T
571
(574)
17
20
153
400
20
2.0
2.4
20
50
4
TLFGE53T
565
(568)
15
20
85
200
20
2.0
2.4
20
50
4
TLPGE53T
558
(562)
14
20
47.6
130
20
2.1
2.4
20
50
4
Unit
nm
mA
mcd
mA
V
mA
A
V
Precautions
Please be careful of the following:
Soldering temperature: 260°C max, soldering time: 3 s max
(soldering portion of lead: up to 2 mm from the body of the device)
If the lead is formed, the lead should be formed up to 5 mm from the body of the device without forming stress to
the resin. Soldering should be performed after lead forming.
This visible LED lamp also emits some IR light.
If a photodetector is located near the LED lamp, please ensure that it will not be affected by this IR light.
相關(guān)PDF資料
PDF描述
TLOE53T TOSHIBA InGaALP LED
TLPGE53T TOSHIBA InGaALP LED
TLPYE53T TOSHIBA InGaALP LED
TLRE53T TOSHIBA InGaALP LED
TLRME53T TOSHIBA InGaALP LED
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