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參數(shù)資料
| 型號： | TLFGE19CPF |
| 廠商： | Toshiba Corporation |
| 英文描述： | Panel Circuit Indicator |
| 中文描述： | 面板電路指標(biāo) |
| 文件頁數(shù)： | 1/3頁 |
| 文件大?。?/td> | 211K |
| 代理商： | TLFGE19CPF |
TLFGE19CP(F)
2007-10-01
1
TOSHIBA
TLFGE19CP(F)
P
InGaA
l
LED
○
Panel Circuit Indicator
Pb(Lead) free (Sn-Ag-Cu)
5mm package
InGaA
P
Colored, transparent lens
Color: Green
Applications: Various types of information panels, indicators for
amusement equipment and panel backlighting illumination sources.
Stopper lead type is also available.
TLFGE19C(F)
Absolute Maximum Ratings
(Ta
=
25°C)
CHARACTERISTICS
SYMBOL
RATING
UNIT
FORWARD CURRENT
I
F
50
mA
REVERSE VOLTAGE
V
R
4
V
POWER DISSIPATION
P
D
120
mW
OPERATING TEMPERATURE
T
opr
4
0~100
°C
STORAGE TEMPERATURE
T
stg
40~120
°C
Note: Using continuously under heavy loads (e.g. the application of high
temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical and Optical Characteristics
(Ta
=
25°C)
CHARACTERISTICS
SYMBOL
TEST CONDITION
MIN
TYP
MAX
UNIT
FORWARD VOLTAGE
V
F
I
F
=20mA
2.0
2.4
V
REVERSE CURRENT
I
R
V
R
=4V
50
μ
A
LUMINOUS INTENSITY
I
V
I
F
=20mA(Note)
272
800
mcd
PEAK WAVELENGTH
λ
P
I
F
=20mA
(568)
nm
SPECTRAL LINE HALF WIDTH
Δλ
I
F
=20mA
15
nm
DOMINANT WAVELENGTH
λ
d
I
F
=20mA(Note)
559
565
570
nm
Note: Lamps are classified into the following ranks according to their luminous intensity. Each packing box includes
single Luminous Intensity class.
I
V
Q:272-736mcd, R:476-1290mcd, S:850mcd -
λ
d
1: 559-567nm, 2: 563-570nm
Precautions
Please be careful of the following:
Soldering temperature: 260°C max, soldering time: 3 s max
(soldering portion of lead: up to 1.6 mm from the body of the device)
If the lead is formed, the lead should be formed up to 1.6 mm from the body of the device without forming
stress to the resin. Soldering should be performed after lead forming.
This visible LED lamp also emits some IR light.
If a photo detector is located near the LED lamp, please ensure that it will not be affected by this IR light.
Unit
: mm
JEDEC
-
EIAJ
-
TOSHIBA
4-5AM2
Weight: 0. 31g(Typ.)
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