
Orderable Device
Status
(1)
Package
Type
SOIC
Package
Drawing
D
Pins Package
Qty
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
25
Pb-Free
(RoHS)
25
Pb-Free
(RoHS)
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
TLE2064CDR
ACTIVE
14
Call TI
Level-1-260C-UNLIM
TLE2064CDRG4
ACTIVE
SOIC
D
14
Call TI
Level-1-260C-UNLIM
TLE2064CN
ACTIVE
PDIP
N
14
CU NIPDAU
N / A for Pkg Type
TLE2064CNE4
ACTIVE
PDIP
N
14
CU NIPDAU
N / A for Pkg Type
TLE2064CNSR
TLE2064ID
OBSOLETE
ACTIVE
SO
SOIC
NS
D
14
14
TBD
Call TI
Call TI
Call TI
Level-1-260C-UNLIM
50
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
25
Pb-Free
(RoHS)
25
Pb-Free
(RoHS)
50
50
Green (RoHS &
no Sb/Br)
2500
2500 Green (RoHS &
no Sb/Br)
1
1
1
TLE2064IDG4
ACTIVE
SOIC
D
14
50
Call TI
Level-1-260C-UNLIM
TLE2064IDR
ACTIVE
SOIC
D
14
Call TI
Level-1-260C-UNLIM
TLE2064IDRG4
ACTIVE
SOIC
D
14
Call TI
Level-1-260C-UNLIM
TLE2064IN
ACTIVE
PDIP
N
14
CU NIPDAU
N / A for Pkg Type
TLE2064INE4
ACTIVE
PDIP
N
14
CU NIPDAU
N / A for Pkg Type
TLE2064MD
TLE2064MDG4
ACTIVE
ACTIVE
SOIC
SOIC
D
D
14
14
TBD
CU NIPDAU
CU NIPDAU
Level-1-220C-UNLIM
Level-1-260C-UNLIM
TLE2064MDR
TLE2064MDRG4
ACTIVE
ACTIVE
SOIC
SOIC
D
D
14
14
TBD
CU NIPDAU
CU NIPDAU
Level-1-220C-UNLIM
Level-1-260C-UNLIM
TLE2064MFKB
TLE2064MJ
TLE2064MJB
TLE2064MN
TLE2064MWB
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
ACTIVE
LCCC
CDIP
CDIP
PDIP
CFP
FK
J
J
N
W
20
14
14
14
14
TBD
TBD
TBD
TBD
TBD
POST-PLATE
A42 SNPB
A42 SNPB
Call TI
A42 SNPB
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
Call TI
N / A for Pkg Type
1
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
PACKAGE OPTION ADDENDUM
www.ti.com
11-Oct-2007
Addendum-Page 5