參數(shù)資料
型號(hào): TLC556MDRG4
廠商: TEXAS INSTRUMENTS INC
元件分類: 模擬波形發(fā)生器
英文描述: DUAL PULSE; RECTANGULAR, 1.2 MHz, TIMER, PDSO14
封裝: GREEN, PLASTIC, MS-012AB, SOIC-14
文件頁數(shù): 15/21頁
文件大小: 609K
代理商: TLC556MDRG4
TLC556, TLC556Y
DUAL LinCMOS
TIMERS
SLFS047B – FEBRUARY 1984 – REVISED SEPTEMBER 1997
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TLC556Y chip information
These chips, properly assembled, display characteristics similar to the TLC556 (see electrical table). Thermal
compression or ultrasonic bonding may be used on the doped aluminum bonding pads. Chips may be mounted
with conductive epoxy or a gold-silicon preform.
OUT
DISCH
R1
R
S
1
RESET
CONT
VDD
THRESH
R
GND
TRIG
(3)
(5)
(1)
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4
× 4 MINIMUM
TJ max = 150°C
TOLERANCES ARE
±10%
ALL DIMENSIONS ARE IN MILS
NO BACKSIDE METALLIZATION
PIN (7) INTERNALLY CONNECTED
TO BACKSIDE OF CHIP
FUNCTIONAL BLOCK DIAGRAM (EACH TIMER)
(4)
(14)
(2)
(6)
(7)
61
97
相關(guān)PDF資料
PDF描述
TLC556MN DUAL PULSE; RECTANGULAR, 1.2 MHz, TIMER, PDIP14
TLC556MJ DUAL PULSE; RECTANGULAR, 1.2 MHz, TIMER, CDIP14
TLC556CDG4 DUAL PULSE; RECTANGULAR, 1.2 MHz, TIMER, PDSO14
5962-89621012A OP-AMP, 10000 uV OFFSET-MAX, 40 MHz BAND WIDTH, CQCC20
5962-8962101VPA OP-AMP, 10000 uV OFFSET-MAX, 40 MHz BAND WIDTH, CDIP8
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