參數(shù)資料
型號(hào)： TLC2322
廠商： Texas Instruments, Inc.
英文描述： Low-Voltage Low-Power Operational Amplifier(低壓低功耗運(yùn)放)
中文描述： 低電壓低功耗運(yùn)算放大器（低壓低功耗運(yùn)放）
文件頁(yè)數(shù)： 2/33頁(yè)
文件大?。?/td> 472K
代理商： TLC2322
TLV2322, TLV2322Y, TLV2324, TLV2324Y
LinCMOS
LOW-VOLTAGE LOW-POWER
OPERATIONAL AMPLIFIERS
SLOS187 – FEBRUARY 1997
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
description (continued)
Low-voltage and low-power operation has been made possible by using the Texas Instruments silicon-gate
LinCMOS technology. The LinCMOS process also features extremely high input impedance and ultra-low bias
currents making these amplifiers ideal for interfacing to high-impedance sources such as sensor circuits or filter
applications.
To facilitate the design of small portable equipment, the TLV232x is made available in a wide range of package
options, including the small-outline and thin-shrink small-outline packages (TSSOP). The TSSOP package has
significantly reduced dimensions compared to a standard surface-mount package. Its maximum height of only
1.1 mm makes it particularly attractive when space is critical.
The device inputs and outputs are designed to withstand –100-mA currents without sustaining latch-up. The
TLV232x incorporates internal ESD-protection circuits that prevent functional failures at voltages up to 2000 V
as tested under MIL-STD 883C, Method 3015.2; however, care should be exercised in handling these devices
as exposure to ESD can result in the degradation of the device parametric performance.
TLV2322Y chip information
This chip, when properly assembled, displays characteristics similar to the TLV2322I. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4
×
4 MILS MINIMUM
TJmax = 150
°
C
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
+
–
1OUT
1IN+
1IN–
VDD
VDD–/GND
(8)
(3)
(2)
(4)
+
–
2OUT
2IN+
2IN–
(5)
(6)
59
72
(5)
(4)
(3)
(2)
(6)
(7)
(8)
(1)
相關(guān)PDF資料
PDF描述
TLC2324 Low-Voltage Low-Power Operational Amplifier(低壓低功耗運(yùn)放)
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TLC2543-EVM TLC2543 Evaluation Module(TLC2543評(píng)估板)
TLC2554(中文) 5-V, 12-BIT, 400 KSPS, 4 Channel, Low Power, Serial Analog-to-Digital Converters With Auto Power Down(2.7V-5.5V,12位,400KSPS,四通道,低功耗,自動(dòng)掉電的串行ADC)
TLC2558(中文) 5-V, 12-BIT, 400 KSPS, 8 Channel, Low Power, Serial Analog-to-Digital Converters With Auto Power Down(2.7V-5.5V,12位,400KSPS 8通道,低功耗,自動(dòng)掉電的串行A/D轉(zhuǎn)換器)
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參數(shù)描述
TLC2472ID 制造商:Rochester Electronics LLC 功能描述:- Bulk
TLC251ACD 功能描述:運(yùn)算放大器 - 運(yùn)放 Programmable RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
TLC251ACDG4 功能描述:運(yùn)算放大器 - 運(yùn)放 Programmable RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
TLC251ACDR 功能描述:運(yùn)算放大器 - 運(yùn)放 Programmable Lo-Pwr Op Amp RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
TLC251ACDRG4 功能描述:運(yùn)算放大器 - 運(yùn)放 Programmable Lo-Pwr Op Amp RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
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