
TL2218-285, TL2218-285Y
EXCALIBUR CURRENT-MODE SCSI TERMINATOR
SLVS072C – DECEMBER 1992 – REVISED OCTOBER 1995
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
8–3
functional block diagram (each channel)
Thermal
Regulation
Feedback
Active
Negation
Clamp
TERMPWR
1, 20
4
19
Vref
DISABLE
D0
Common to All Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
(see Figures 1, 2, and 3)
Continuous termination voltage
Continuous output voltage range
Continuous disable voltage range
Continuous total power dissipation
Operating virtual junction temperature range, T
J
Storage temperature range, T
stg
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
10 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
0 V to 5.5 V
0 V to 5.5 V
See Dissipation Rating Table
–55
°
C to 150
°
C
–60
°
C to 150
°
C
260
°
C
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATING TABLE
PACKAGE
POWER RATING
AT
T
≤
25
°
C
DERATING FACTOR
ABOVE T = 25
°
C
T = 70
°
C
T = 85
°
C
T = 125
°
C
POWER RATING
POWER RATING
POWER RATING
POWER RATING
TA
TC
TL
828 mW
6.62 mW/
°
C
32.2 mW/
°
C
19.8 mW/
°
C
530 mW
430 mW
166 mW
PW
4032 mW
2583 mW
2100 mW
812 mW
2475 mW
1584 mW
1287 mW
495 mW
R
θ
JL is the thermal resistance between the junction and device lead. To determine the virtual junction temperature (TJ) relative to the device lead
temperature, the following calculations should be used: TJ = PD x R
θ
JL + TL, where PD is the internal power dissipation of the device and TL is
the device lead temperature at the point of contact to the printed wiring board. R
θ
JL is 50.5
°
C/W.