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參數(shù)資料
| 型號(hào)： | TL2218-285YPW |
| 廠(chǎng)商： | Texas Instruments, Inc. |
| 英文描述： | EXCALIBUR CURRENT-MODE SCSI TERMINATOR |
| 中文描述： | 神劍電流模式的SCSI終結(jié)者 |
| 文件頁(yè)數(shù)： | 6/9頁(yè) |
| 文件大?。?/td> | 169K |
| 代理商： | TL2218-285YPW |
TL2218-285, TL2218-285Y
EXCALIBUR CURRENT-MODE SCSI TERMINATOR
SLVS072C – DECEMBER 1992 – REVISED OCTOBER 1995
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
8–6
THERMAL INFORMATION
The need for smaller surface-mount packages for use on compact printed-wiring boards (PWB) causes an
increasingly difficult problem in the area of thermal dissipation. In order to provide the systems designer with a better
approximation of the junction temperature rise in the thin-shrink small-outline package (TSSOP), the junction-to-lead
thermal resistance (R
θ
JL
) is provided along with the more typical values of junction-to-ambient and junction-to-case
thermal resistances, R
θ
JA
and R
θ
JC
.
R
θ
JL
is used to calculate the device junction temperature rise measured from the leads of the unit. Consequently, the
junction temperature is dependent upon the board temperature at the leads, R
θ
JL
, and the internal power dissipation
of the device. The board temperature is contingent upon several variables, including device packing density,
thickness, material, area, and number of interconnects. The R
θ
JL
value depends on the number of leads connecting
to the die-mount pad, the lead-frame alloy, area of the die, mount material, and mold compound. Since the power level
at which the TSSOP can be used is highly dependent upon both the temperature rise of the PWB and the device itself,
the systems designer can maximize this level by optimizing the circuit board. The junction temperature of the device
can be calculated using the equation T
J
= (P
D
×
R
θ
JL
) + T
L
where T
J
= junction temperature, P
D
= power dissipation,
R
θ
JL
= junction-to-lead thermal resistance, and T
L
= board temperature at the leads of the unit.
The values of thermal resistance for the TL2218-285 PW are as follows:
Thermal Resistance
R
θ
JA
R
θ
JC
R
θ
JL
Typical Junction Rise
151
°
C/W
31
°
C/W
50.5
°
C/W
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
IO
VO
IO
VO
Output current
vs Input voltage
4
Output voltage
vs Input voltage
5
Output current
vs Junction temperature
6
Output voltage
vs Junction temperature
7
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|---|---|
| TL2218 | EXCALIBUR CURRENT-MODE SCSI TERMINATOR |
| TL2218-285Y | EXCALIBUR CURRENT-MODE SCSI TERMINATOR |
| TL22I7-285KTP | FIXED-VOLTAGE REGULATORS FOR SCSI ACTIVE TERMINATION |
| TL2217-285KTP | FIXED-VOLTAGE REGULATORS FOR SCSI ACTIVE TERMINATION |
| TL2217-285 | FIXED-VOLTAGE REGULATORS FOR SCSI ACTIVE TERMINATION |
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