
TL2217-285
FIXED-VOLTAGE REGULATORS
FOR SCSI ACTIVE TERMINATION
SLVS066F – NOVEMBER 1991 – REVISED JULY 1999
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
AVAILABLE OPTIONS
PACKAGED DEVICES
CHIP
FORM
(Y)
TJ
PLASTIC
POWER
(KC)
PLASTIC FLANGE
MOUNT
(KTP)
SURFACE
MOUNT
(PW)
0
°
C to 125
°
C
The KTP and PW packages are only available taped and reeled. Add the suffix R to the device type
(e.g., TL2217–285KTPR). Chip forms are tested at 25
°
C.
TL2217-285KC
TL22I7-285KTP
TL22I7-285PWR
TL2217-285Y
absolute maximum ratings over operating virtual junction temperature range (unless otherwise
noted)
Continuous input voltage, V
I
Operating virtual junction temperature range, T
J
Package thermal impedance,
θ
JA
(see Notes 1 and 2): KC package
7.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
–55
°
C to 150
°
C
22
°
C/W
28
°
C/W
83
°
C/W
260
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
KTP package
PW package
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds
Storage temperature range, T
stg
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. Maximum power dissipation is a function of TJ(max),
θ
JA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) – TA)/
θ
JA. Operating at the absolute maximum TJ of 150
°
C can impact reliability. Due to
variations in individual device electrical characteristics and thermal resistance, the built-in thermal overload protection may be
activated at power levels slightly above or below the rated dissipation.
2. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace
length of zero.
–65
°
C to 150
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
recommended operating conditions
MIN
MAX
UNIT
Input voltage, VI
Output current, IO
Operating virtual junction temperature range, TJ
3.85
5.5
V
0
500
mA
°
C
TL2217–285
0
125