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參數(shù)資料
| 型號(hào)： | TL034Y |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | ENHANCED-JFET LOW-POWER LOW-OFFSET OPERATIONAL AMPLIFIERS |
| 中文描述： | 增強(qiáng)型場(chǎng)效應(yīng)低功耗低失調(diào)運(yùn)算放大器 |
| 文件頁(yè)數(shù)： | 6/56頁(yè) |
| 文件大?。?/td> | 887K |
| 代理商： | TL034Y |
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TL03x, TL03xA, TL03xY
ENHANCED-JFET LOW-POWER LOW-OFFSET
OPERATIONAL AMPLIFIERS
SLOS180B – FEBRUARY 1997 – REVISED FEBRUARY 1999
6
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TL032Y chip information
This chip, when properly assembled, has characteristics similar to the TL032C. Thermal compression or
ultrasonic bonding can be used on the doped-aluminum bonding pads. These chips can be mounted with
conductive epoxy or a gold-silicon preform.
Bonding-Pad Assignments
Chip Thickness: 15 Mils Typical
Bonding Pads: 4
×
4 Mils Minimum
TJ(max) = 150
°
C
Tolerances Are
±
10%.
All Dimensions Are in Mils.
Pin (4) is Internally Connected to Backside of Chip.
+
–
1OUT
1IN+
1IN–
VCC+
(8)
(6)
(3)
(2)
(5)
(1)
–
+
(7)
2IN+
2IN–
2OUT
(4)
VCC–
67
51
(6)
(5)
(4)
(3)
(2)
(1)
(8)
(7)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TL034AMD | ENHANCED-JFET LOW-POWER LOW-OFFSET OPERATIONAL AMPLIFIERS |
| TL034AMJ | ENHANCED-JFET LOW-POWER LOW-OFFSET OPERATIONAL AMPLIFIERS |
| TL031AMJG | ENHANCED-JFET LOW-POWER LOW-OFFSET OPERATIONAL AMPLIFIERS |
| TL031AMP | ENHANCED-JFET LOW-POWER LOW-OFFSET OPERATIONAL AMPLIFIERS |
| TL031MD | ENHANCED-JFET LOW-POWER LOW-OFFSET OPERATIONAL AMPLIFIERS |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TL03X | 制造商:TI 制造商全稱:Texas Instruments 功能描述:ENHANCED-JFET LOW-POWER LOW-OFFSET OPERATIONAL AMPLIFIERS |
| TL03X_08 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:ENHANCED-JFET LOW-POWER LOW-OFFSET OPERATIONAL AMPLIFIERS |
| TL03XA | 制造商:TI 制造商全稱:Texas Instruments 功能描述:ENHANCED-JFET LOW-POWER LOW-OFFSET OPERATIONAL AMPLIFIERS |
| TL03XY | 制造商:TI 制造商全稱:Texas Instruments 功能描述:ENHANCED-JFET LOW-POWER LOW-OFFSET OPERATIONAL AMPLIFIERS |
| TL04013 | 制造商:ELLIOTT LUCAS 功能描述:COMBINATION PLIER 160MM |
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