參數(shù)資料
型號: TL034MFK
廠商: Texas Instruments, Inc.
元件分類: 運動控制電子
英文描述: ENHANCED-JFET LOW-POWER LOW-OFFSET OPERATIONAL AMPLIFIERS
中文描述: 增強(qiáng)型場效應(yīng)低功耗低失調(diào)運算放大器
文件頁數(shù): 6/56頁
文件大?。?/td> 887K
代理商: TL034MFK
TL03x, TL03xA, TL03xY
ENHANCED-JFET LOW-POWER LOW-OFFSET
OPERATIONAL AMPLIFIERS
SLOS180B – FEBRUARY 1997 – REVISED FEBRUARY 1999
6
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TL032Y chip information
This chip, when properly assembled, has characteristics similar to the TL032C. Thermal compression or
ultrasonic bonding can be used on the doped-aluminum bonding pads. These chips can be mounted with
conductive epoxy or a gold-silicon preform.
Bonding-Pad Assignments
Chip Thickness: 15 Mils Typical
Bonding Pads: 4
×
4 Mils Minimum
TJ(max) = 150
°
C
Tolerances Are
±
10%.
All Dimensions Are in Mils.
Pin (4) is Internally Connected to Backside of Chip.
+
1OUT
1IN+
1IN–
VCC+
(8)
(6)
(3)
(2)
(5)
(1)
+
(7)
2IN+
2IN–
2OUT
(4)
VCC–
67
51
(6)
(5)
(4)
(3)
(2)
(1)
(8)
(7)
相關(guān)PDF資料
PDF描述
TL034AMN ENHANCED-JFET LOW-POWER LOW-OFFSET OPERATIONAL AMPLIFIERS
TL034MJ ENHANCED-JFET LOW-POWER LOW-OFFSET OPERATIONAL AMPLIFIERS
TL034Y ENHANCED-JFET LOW-POWER LOW-OFFSET OPERATIONAL AMPLIFIERS
TL034AMD ENHANCED-JFET LOW-POWER LOW-OFFSET OPERATIONAL AMPLIFIERS
TL034AMJ ENHANCED-JFET LOW-POWER LOW-OFFSET OPERATIONAL AMPLIFIERS
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TL034MFKB 制造商:Texas Instruments 功能描述:
TL034MJ 制造商:TI 制造商全稱:Texas Instruments 功能描述:ENHANCED-JFET LOW-POWER LOW-OFFSET OPERATIONAL AMPLIFIERS
TL034MJB 制造商:TI 制造商全稱:Texas Instruments 功能描述:ENHANCED-JFET LOW-POWER LOW-OFFSET OPERATIONAL AMPLIFIERS
TL034MN 制造商:TI 制造商全稱:Texas Instruments 功能描述:ENHANCED-JFET LOW-POWER LOW-OFFSET OPERATIONAL AMPLIFIERS
TL034Y 制造商:TI 制造商全稱:Texas Instruments 功能描述:ENHANCED-JFET LOW-POWER LOW-OFFSET OPERATIONAL AMPLIFIERS